Power-one Limited

Stanton W Ross

Terry Lee Erskine

A mounting system for mounting a semiconductor device to a heat sink is disclosed. The mounting system is for mounting a semiconductor package having a semiconductor die, a heat spreader, a body of non-conductive material around the semiconductor die, and a plurality of leads to a heat sink comprising a sheet of thermally conductive material. The mounting system comprises two primary elements: a rigid retainer and a pressure clamp. The rigid retainer comprises a block of non-conductive material having recess open to at least two adjacent faces of the block of non-conductive material and configured to expose at least a portion of the heat spreader when the semiconductor package is disposed in the recess with the plurality of leads extending from the retainer. The pressure clamp is configured for disposing against an exterior of the retainer opposite to the body and attaching to the heat sink, for compressing the package against the heat sink.

Mounting system for high-voltage semiconductor device

A handle for electronic components is provided that retains the mechanical function of prior art handles and provides for integration of electronic features, such as indicator lights and associated labels, on a portion of the handle. The present handle is mechanically attached to its associated electronic package, and is also electrically connected to the electronics within the package to provide for operation of the handle's integrated electronic features. Electronic features, for example, status indicators and adjustment features, are positioned on the handle so that the features are available at the front of the component, without using space on the front panel of the electronic package. The handle is especially useful for compact, rack-mounted electronics units.

Handle integrating mechanical functions with electronic status indicators and adjustment feature

A bus bar with integrated quick-disconnect terminals for distributing electrical current from a power supply or other electronic component is disclosed. The bus bar and terminals are comprised of a single piece of copper alloy or other suitable bus bar material. The quick-disconnect terminals are blades configured to connect to industry standard receptacles. The bus bar additionally includes integral threaded inserts or other alternate means to provide direct attachment of lugs or other terminals using threaded fasteners, and pins for electrical engagement with power and ground traces on a circuit board.

Multiple function high current interconnect with integrated bus bar

A bus bar with integrated quick-disconnect terminals for distributing electrical current from a power supply or other electronic component is disclosed. The bus bar and terminals are comprised of a single piece of copper alloy or other suitable bus bar material. The quick-disconnect terminals are blades configured to connect to industry standard receptacles. The bus bar additionally includes integral threaded inserts or other alternate means to provide direct attachment of lugs or other terminals using threaded fasteners, and pins for electrical engagement with power and ground traces on a printed circuit board.

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Simi Valley, CA, United States of America

Stanton W Ross