Motorola Corporation

Continental Automotive Systems Corporation

Stanton Rak

Jinbao Jiao

Ying Wang

Mark D Gunderson

Romy Sheynis

David Tseung

A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.

3D-printed, PCB composite structures, and formation methods

A silicone composition is provided that is resistant to a hydrocarbon fluid, such as a transmission fluid, and other harsh environments when cured. The silicone composition includes a dihydroxy-terminated silicone fluid, a filler material and amine-cured cross-linking agent, the composition containing substantially no plasticizer, and wherein the cured composition can be utilized as a sealant that is resistant to exposure to transmission fluid and high temperatures for extended periods of time. The silicone composition provides effective sealant properties that withstand the foregoing conditions present in the transmission fluids. Methods of making and using the cured silicone sealants made from the present compositions are also provided.

Amine-cured silicone compositions resistant to hydrocarbon fluid and uses thereof

A method and module for securing a conductive interconnect ( ) through a metallic substrate ( ). The method includes the steps of: forming a hole ( ) in the metallic substrate ( ), the hole ( ) defined by an internal surface ( ) of the metallic substrate ( ); applying an electrically insulating layer ( ) to the metallic substrate ( ) including the internal surface ( ); applying a solderable coating ( ) to at least a portion of the electrically insulating layer ( ) around the hole ( ); applying a solder ( ) to at least a portion of the solderable coating ( ) at and above the hole ( ); inserting the conductive interconnect ( ) through the hole ( ); and solder bonding the conductive interconnect ( ) within the hole ( ).

Method and apparatus for securing an electrically conductive interconnect through a metallic substrate

An electronic control module ( ) comprising a housing ( ), a printed circuit board ( ), and a rigidizer ( ). The housing ( ) has an opening or window ( ) for a removable connector ( ). The printed circuit board ( ) has a first side ( ), a second side ( ), and a plurality of contact pads ( ). The first side ( ) of the board ( ) is used to retain components and circuitry. The plurality of contact pads ( ) is positioned on the first side ( ) of the printed circuit board ( ). The rigidizer ( ) is attached to the second side ( ) of the printed circuit board ( ) and provides structural backing for the printed circuit board ( ) to compensate for any pressure induced to the first side ( ) of the printed circuit board ( ) by the removable connector ( ). The window ( ) in the housing ( ) is positioned adjacent to the plurality of contact pads ( ) on the first side ( ) of the printed circuit board ( ) to provide a single opening to each of the contact pads ( ). There is also method of assembling the electronic control module ( ).

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Evanston, IL, United States of America

Stanton Rak