General Electric Company

Lumination LLC

Gelcore, LLC

Lockheed Martin Corporation

Ge Lighting Solutions LLC

Haier US Appliance Solutions, Inc.

Martin Marietta Corporation

Generla Electric Company

Stanton Earl Weaver, Jr

Mehmet Arik

Charles Erklin Seeley

Yogen Vishwas Utturkar

Charles Adrian Becker

Robert J Wojnarowski

Thomas Elliot Stecher

Rajdeep Sharma

Alok Mani Srivastava

Holly Ann Comanzo

Anant Achyut Setlur

Thomas Frederick Soules

Hendrik Pieter Jacobus De Bock

Glenn Howard Kuenzler

Emil Vergilov Radkov

Shakti Singh Chauhan

Ivan Eliashevich

Tao Deng

Charles Franklin Wolfe, Jr

Srinath K Aanegola

Chen-Lun Hsing Chen

Steven Francis LeBoeuf

Gary Robert Allen

Todd Garrett Wetzel

James Thomas Petroski

David Mulford Shaddock

Mathew L Sommers

Tunc Icoz

Boris Kolodin

Christopher James Kapusta

James Wilson Rose

Kevin Matthew Durocher

Joseph John Shiang

Stephen Daley Arthur

Deborah Ann Haitko

Renato Guida

Bernard Gorowitz

Mark Howard Giammattei

David C Dudik

Mark Edward Kaminski

Laura Jean Meyer

Donald Joseph Buckley

James Reginelli

Christopher L Bohler

Graham Charles Kirk

Ertugrul Berkcan

Wolfgang Daum

Jesse Berkley Tucker

William Dwight Gerstler

Richard J Saia

Arun Virupaksha Gowda

Thomas Bert Gorczyca

James Lee Armstrong

Slawomir Rubinsztajn

Kanakasabapathi Subramanian

John Stanley Glaser

Joseph Alfred Iannotti

John Patrick Lemmon

Matthew S Mrakovich

Steven Jude Duclos

Joseph Darryl Michael

Chellappa Balan

Peter Micah Sandvik

Marco Francesco Aimi

Brian Magann Rush

Matthew Christian Nielsen

William Edward Burdick, Jr

Jeffrey Marc Nall

Vinayak Tilak

Constantine A Neugebauer

Shankar Chandrasekaran

Ramanujam Ramabhadran

Ernest Wayne Balch

Vance Scott Robinson

James Enrico Sabatini

Eric J Wildi

Satish Prabhakaran

Stacey Joy Kennerly

Hari S Venugopalan

Dalong Zhong

Venkatesan Manivannan

Larry Burton Rowland

James Claude Carnahan

Tomislav Josip Stimac

Robert James Thomas

Jonathan Lloyd Male

Bryan S Shelton

Michael Gdula

David Shannon Slaton

Kunal Ravindra Goray

Gary Dwayne Mandrusiak

Nandini Nagraj

Wenwu Zhang

Bo Li

Russell William Craddock

Stephen Adam Solovitz

Mark Allen Woodmansee

Robert F Karlicek

Sabrina Marie Hannah

Juan Manuel Rivas Davila

An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.

Systems and methods for hybrid glass and organic packaging for radio frequency electronics

A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.

Integrated heat exchange assembly and an associated method thereof

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Light emitting diode component

A method for monitoring cooking in an oven appliance includes drawing cooking vapors or gases from a cooking chamber to a fluid analysis assembly of the oven appliance during a gas or vapor analysis cooking cycle, determining a cooking status of the food item within the cooking chamber with the controller of the oven appliance based upon a response pattern of a plurality of fluid sensors of the fluid analysis assembly to the cooking vapors or gases during the gas or vapor analysis cooking cycle, and activating an alert with the controller of the oven appliance when the cooking status of the food item within the cooking chamber is a particular cooking status.

Method for monitoring cooking in an oven appliance

A synthetic jet driven cooling device includes at least one synthetic jet actuator to generate and project a series of fluid vortices. A manifold coupled to the synthetic jet actuator(s) receives the fluid vortices and generates a primary air stream. An air amplifier connected to the manifold by a connecting pipe receives the primary air stream. The air amplifier includes an air intake oriented perpendicular to the connecting pipe and an air outlet positioned opposite the air intake, with a venturi section positioned between the air intake and air outlet that has a diameter smaller than the air intake diameter. A low pressure region in a center of the venturi section entrains a surrounding air in through the air intake to generate a secondary air stream that combines with the primary air stream to generate a combined air flow that flows through the venturi and exits the air outlet.

Synthetic jet driven cooling device with increased volumetric flow

A light source () comprises a light engine (), a base (), a power conversion circuit () and an enclosure (). The light engine () comprises at least one LED () disposed on a platform (). The platform () is adapted to directly mate with the base () which a standard incandescent bulb light base. Phosphor () receives the light generated by the at least one LED () and converts it to visible light. The enclosure () has a shape of a standard incandescent lamp.

LED-based light bulb

A synthetic jet includes a first backer structure, one and only one actuator, a wall member coupled to and positioned between the first backer structure and the one and only one actuator to form a cavity, and wherein the wall member has an orifice formed therethrough, and wherein the orifice fluidically couples the cavity to an environment external to the cavity.

Method and apparatus for reducing acoustic noise in a synthetic jet

A directional lamp comprises a light source, a beam forming optical system configured to form light from the light source into a light beam, and a light mixing diffuser arranged to diffuse the light beam. The light source, beam forming optical system, and light mixing diffuser are secured together as a unitary lamp. The beam forming optical system includes: a collecting reflector having an entrance aperture receiving light from the light source and an exit aperture that is larger than the entrance aperture, and a lens disposed at the exit aperture of the collecting reflector, the light source being positioned along an optical axis of the beam forming optical system at a distance from the lens that is within plus or minus ten percent of a focal length of the lens.

Directional lamp with beam forming optical system including a lens and collecting reflector

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system includes a plurality of synthetic jets. The synthetic jets are arranged within the lighting system such that they are secured at contact points.

Lighting system with thermal management system having point contact synthetic jets

An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.

Electronics chassis and method of fabricating the same

A cooling system includes a synthetic jet having a first synthetic jet lead and a second synthetic jet lead. The cooling system also includes a capacitor having a first capacitor lead and a second capacitor lead. The first capacitor lead is coupled to the first synthetic jet lead. The synthetic jet is configured to be powered via an alternating current (AC) power source coupled to the second capacitor lead and to the second synthetic jet lead.

Power circuitry for a synthetic jet of a cooling system

A cooling system is provided. The cooling system includes an enclosure. The enclosure is defined by walls among which at least one is movable. The enclosure further includes at least one aperture on at least one wall. The system further includes an amplification element that is coupled with at least one walls of the enclosure. Further, the cooling system includes an actuation unit mechanically coupled with the amplification element. The actuation unit includes at least one actuation signal triggered actuator configured to cause a displacement the amplification element. In the cooling system, the amplification element is configured to amplify the actuator caused displacement through to the at least one wall of the enclosure such that fluid enters and exits the enclosure from the at least one aperture.

System for cooling devices

A micro-electromechanical (MEM) synthetic jet actuator includes a semiconductor substrate having a cavity extending therethrough, such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The first flexible membrane also includes an orifice formed therein aligned with the first opening. The MEM synthetic jet actuator also includes a second flexible membrane that is formed on at least a portion of the second surface of the semiconductor substrate and that extends over the second opening, and a pair of actuator elements coupled to the flexible membranes and aligned with the cavity to selectively cause displacement of the first and second flexible membranes.

System and method for miniaturization of synthetic jets

A thermal management system for electronic devices is provided. The thermal management system includes a plurality of synthetic jets provided in a stacked arrangement and separated by respective spacers within the stacked arrangement. The stack of synthetic jets may be used to facilitate airflow in the thermal management system, such as to facilitate air flow over a heat sink in one implementation.

Thermal management in optical and electronic devices

Growing community of inventors

Northville, NY, United States of America

Stanton Earl Weaver, Jr