International Business Machines Corporation

Stanley Zirinsky

Victor J Silvestri

Arnold Reisman

Melvin Berkenblit

Billy L Crowder

See Ark Chan

Eugene A Irene

A method for providing on a substrate a layer of a metal silicide such as molybdenum silicide and/or tantalum silicide and/or tungsten silicide and/or rhodium silicide which includes coevaporating silicon and the respective metal onto a substrate, and then heat treating the substrate to form the metal silicide.

Method for providing a metal silicide layer on a substrate

A method for etching at least one aperture having a defined crystallographic geometry in single crystals which includes masking the crystal to protect predetermined portions thereof from being etched, and then anisotropically etching with a mixture of sulfuric acid and phosphoric acid.

Process for etching holes

Method for depositing a layer containing Al; N, and Si on a substrate which comprises providing a substrate to be coated, a carrier gas, and a gaseous mixture of nitrogen source compounds, aluminum source compounds and silicon source material and heating the substrate to a temperature in the range of about 500.degree. to about 1,300.degree. C to thereby cause formation on the substrate of a layer containing Al, N, and Si; and products obtained by the method.

Growing community of inventors

Bronx, NY, United States of America

Stanley Zirinsky