Luminit LLC

Stanley Tafeng Kao

Engin B Arik

Leo Katsenelenson

Philip Yi Zhi Chu

Edward M Kaiser

Thomas C Forrester

Anthony Ang

Fedor Dimov

Jun Ai

Xiaowei Xia

Chris Griffo

Jay Perlin

Chinmaya Dharmadhikari

Christopher Leister

Lev Katsenelenson

Neven Rakuljlc

Multiple pairs of substrate-guided wave-based holograms (SGWHs) are laminated to a common thin substrate to form a transparent substrate-guided wave-based holographic CHMSL (SGWHC) that diffracts playback LED illumination over a wide angular range. This device is made pursuant to a technique that includes the steps of recording a first set of SGWHs with one setup, that upon playback, will couple and guide the diffracted light inside the substrate, and a second set of SGWHs recorded with another setup, that will diffract and couple the guided light out.

Substrate-guided wave-based transparent holographic center high mounted stop light and method of fabrication thereof

The optical diffuser mastering of the subject invention includes legacy microstructure surface relief patterns, along with smaller ones, overlaid on the larger ones. The characteristic features produced by the present invention will be found useful to eliminate visible structures in/on optical diffusers, such as those used in movie projection screens (utilizing either coherent (i.e., laser-generated) and non-coherent (e.g., lamp-generated) light), head-up displays (HUDs), laser projection viewing, etc., as the present invention produces much sharper images than those afforded by traditional holographic optical diffusers.

Composite holographic optical diffuser structure with high frequency overlay and method of fabrication thereof

Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.

Method to provide microstructure for encapsulated high-brightness LED chips

The present disclosure reveals a reflective, front-projection screen designed to faithfully and accurately display the images from state-of-the-art (SOTA) and next-generation 2D and 3D motion-picture projectors, such as those found in large-capacity public movie theaters, home theaters, offices, and for use with portable projection systems for consumer and commercial applications. In particular it discloses cinema-size light shaping 3D projection screens with front-surface microstructures and horizontal viewing angles in the range of 90 to 120 degrees.

Projection screen for displaying two-dimensional and three-dimensional motion pictures and method of use thereof

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Torrance, CA, United States of America

Stanley Tafeng Kao