Olin Corporation

Swiss Aluminium Ltd.

Stanley Shapiro

Brian Mravic

Eugene Shapiro

W Gary Watson

Ronald N Caron

Derek E Tyler

Michael J Pryor

Harvey P Cheskis

Jacob Crane

Ronald G Hardy

Mathur Raghavan

Duncan G Block

Abid A Khan

Richard D Lanam

John Shabarack

William E Mayo

The present invention utilizes the unique addition of yttrium to aluminum base alloys to either enhance the conductivity of such alloys when compared to commercial conductor grade material or provide equivalent conductivity when utilizing grades of aluminum containing higher normal impurity levels. Various processing procedures can be utilized for this material, depending upon the desired final properties.

Electrical conductivity of aluminum alloys through the addition of

The present invention utilizes the unique addition of mischmetal to aluminum base alloys to either enhance the conductivity of such alloys when compared to commercial conductor grade material or provide equivalent conductivity when utilizing grades of aluminum containing higher normal impurity levels. Various processing procedures can be utilized for this material, depending upon the desired final properties.

Improving the electrical conductivity of aluminum alloys through the

A high conductivity high temperature copper alloy containing mischmetal, phosphorus and magnesium with specific ratios among them. The alloy is free from internal copper oxides and may be annealed at elevated temperatures in hydrogen atmospheres without embrittlement. Strengths on the order of 80 KSI and conductivities on the order of 90% IACS are obtainable in cold worked material.

High conductivity high temperature copper alloy

A copper base alloy is disclosed which exhibits improved resistance to crack propagation during hot processing as well as good mechanical properties. The alloy comprises from about 4.0 to about 11.0% tin, from about 0.01 to about 0.3% phosphorus, from about 1.0 to about 5.0% of a material selected from the group consisting of iron and a mixture of iron and cobalt, up to about 0.4% chromium, balance essentially copper. The alloy of the present invention possesses a substantially non-dendritic grain structure in the cast condition which contributes to said resistance to crack propagation.

Copper base alloys possessing improved processability

A process for providing copper base alloys with a combination of high strength and high strength to ductility characteristics is disclosed. The alloys should be those copper alloys which exhibit continuous, homogeneous precipitation of coherent particles such as spinodal decomposition upon precipitation hardening. The alloys are hot worked, solution annealed and subjected to a controlled cooling to provide the desirable strength-ductility combinations.

Processing for improved stress relaxation resistance in copper alloys

New and improved copper base alloys, characterized by a combination of high electrical conductivity and excellent strength properties, consisting essentially of 0.8- 5% by weight of titanium as a first component, a portion of which may be a like element such as zirconium or hafnium or both, 1.2- 5% by weight of antimony as a second component, part of which may be replaced by one or more of the elements arsenic, phosphorus, silicon, germanium and tin, with the atomic ratio of the total titanium and like elements, to antimony and like elements, being not more than 10% above 5:3, and the balance essentially copper.

Copper base alloys with high strength and high electrical conductivity

Copper base alloys having improved rupture properties and improved hot rolling performance consisting of from 2 to 9.5% aluminum, preferably also from 0.001 to 3.0% silicon, a grain refining element, preferably cobalt in an amount from 0.001 to 5.0%, from 0.001 to 0.5% of a material selected from the group consisting of a material of the lanthanide series of the Periodic Table and mixtures thereof, and the balance essentially copper.

Copper base alloys

A process of heat treating and mechanically working copper base alloys containing chromium, zirconium and vanadium is disclosed. The combination of alloying ingredients, hot and cold rolling, annealing and aging steps increases both the strength and electrical conductivity properties of the alloy without excessive cold working or aging.

Method of processing copper base alloys

Spinodal, precipitation hardened copper base alloy is prepared having high strength and favorable strength to ductility characteristics. The alloy consists essentially of from 10 to 30% nickel, 1 to 5% aluminum and the balance essentially copper. The microstructure of the alloy is characterized by including finely dispersed precipitates of Ni.sub.3 Al particles dispersed throughout the alloy matrix.

Preparation of high strength copper base alloy

New and improved copper base alloys, characterized by a combination of high electrical conductivity and excellent strength properties, consisting essentially of 0.8 - 5% by weight of titanium, a portion of which may be a like element such as zirconium or hafnium or both, 1.2 - 5% by weight of antimony, part of which may be replaced by one or more of the elements arsenic, phosphorus, silicon, germanium and tin, with the atomic ratio of the total titanium, and like elements, to antimony, and like elements, being 5:3 or somewhat less, and the balance essentially copper. The desired properties are attained by the proper application of mechanical processing steps and thermal treatments.

An improved copper base alloy having good high temperature properties, such as hot rollability, creep strength and stress rupture life. The alloy contains from about 2 to 9.5% aluminum, from about 0.001 to 3% silicon, and a grain refining element selected from the group consisting of iron from about 0.001 to 5%, chromium from about 0.001 to 1%, zirconium from about 0.001 to 1%, cobalt from about 0.001 to 5% and mixtures thereof. In addition, the alloy contains titanium in an amount from about 0.2 to 1%.

Copper base alloy

Processing copper base alloys to improve the stress corrosion resistance thereof. Copper base alloys containing from 12.5 to 30% nickel and 12.5 to 30% manganese are subjected to a duplex aging treatment in order to improve the stress corrosion resistance thereof.

Processing copper base alloys

Brazing preforms are disclosed which may take the form of wire, sheet or strip, and which are useful for joining copper, ferrous and nickel base alloys. The preforms of this invention are prepared from an alloy which contains manganese from 22 to 40%, iron from 0.1 to 2%, aluminum from 0.1 to 5%, zinc from 2 to 10%, balance essentially copper. A method of brazing is also disclosed which may be performed with or without a flux, and which is conducted in an inert atmosphere, at a temperature of from about 900.degree. to 1100.degree.C. The brazed products of this invention possess reduced brittleness and improved resistance to corrosion.

Brazing preforms and method of brazing

An improved phosphor-bronze copper alloy having good hot workability and mechanical properties, and method of processing same. A preferred alloy contains from 2 to 11% tin, from 0.01 to 0.3% phosphorus, from 0.2 to 0.8% chromium and from 0.3 to 2.0% each of iron and/or cobalt.

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New Haven, CT, United States of America

Stanley Shapiro