Average Co-Inventor Count = 3.92
ph-index = 8
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Qualcomm Incorporated (95 from 41,498 patents)
2. Texas Instruments Corporation (4 from 29,263 patents)
3. Yonsei University (1 from 1,338 patents)
4. Industry-Academic Cooperation Foundation (1 from 21 patents)
99 patents:
1. 12400966 - Package comprising integrated devices and bridge coupling top sides of integrated devices
2. 11973019 - Deep trench capacitors in an inter-layer medium on an interconnect layer of an integrated circuit die and related methods
3. 11830819 - Package comprising integrated devices and bridge coupling top sides of integrated devices
4. 11626359 - Three-dimensional integrated circuit (3D IC) power distribution network (PDN) capacitor integration
5. 11552055 - Integrated circuit (IC) packages employing front side back-end-of-line (FS-BEOL) to back side back-end-of-line (BS-BEOL) stacking for three-dimensional (3D) die stacking, and related fabrication methods
6. 11545555 - Gate-all-around (GAA) transistors with shallow source/drain regions and methods of fabricating the same
7. 11515289 - Stacked die integrated with package voltage regulators
8. 11502079 - Integrated device comprising a CMOS structure comprising well-less transistors
9. 11444068 - Three-dimensional (3D) integrated circuit device having a backside power delivery network
10. 11437379 - Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits
11. 11404374 - Circuits employing a back side-front side connection structure for coupling back side routing to front side routing, and related complementary metal oxide semiconductor (CMOS) circuits and methods
12. 11310911 - Three-dimensional (3D) integrated circuit (IC) integration of an embedded chip and a preformed metal routing structure
13. 11302638 - Hybrid conductor integration in power rail
14. 11270991 - Integrated circuits (ICs) employing front side (FS) back end-of-line (BEOL) (FS-BEOL) input/output (I/O) routing and back side (BS) BEOL (BS-BEOL) power routing for current flow organization, and related methods
15. 11257917 - Gate-all-around (GAA) transistors with additional bottom channel for reduced parasitic capacitance and methods of fabrication