Northrop Grumman Systems Corporation

Westinghouse Electric Corporation

Microsoft Technology Licensing, LLC

Stanley Katsuyoshi Wakamiya

Martin Brokner Christiansen

David Jerome Tilles

Leonard George Chorosinski

H Craig Heffner

Thomas F Grapes

Keith R Kirkwood

Jonathan Francis Van Dyke

Mark S Schroeder

Sharon A Duggan

Diane L Deemer

Mark W Westerdale

Charles Stewart Shaw

Dale H Brown

Harlan Craig Heffner

David Bialik

Bruce A Krein

Kelsey McCusker

Kevin Collao

Jacob L Timm

Daryl Sunny Mileaf

James A Rew

Elie K Track

Charles M Miller

Steven Ward Van Sciver

John J Buckley, Jr

John O Kurtz

Pierre J Campagnolle

Karl Lewis Schuck

James D Mullennix

Francisco J San Miguel

William L DeHaven

Fred S Blake

James D Mullenix

Frank J San Miguel

Tessandra Anne Sage

Joshua P Osborne

Jonathan Shane Atienza

Stephanie Lauretano Miskiewicz

Patrick Cowgill

Kelsey Mccusker

One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.

Cryogenic wafer test system

One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.

Planar ring radiation barrier for cryogenic wafer test system

An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, which are different from one another. A housing defines a housing internal volume which completely three-dimensionally surrounds the circuit card. A first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature concurrently with a second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature.

Forced flow cooling temperature control method, system, and apparatus

An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.

Immersion cooling temperature control method, system, and apparatus

A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.

Circuit card rack system and method

A computing system including a common substrate having both superconducting components and non-superconducting components is provided. The superconducting components may be attached towards a first end of the common substrate and the non-superconducting components may be attached towards a second end, opposite to the first end, of the common substrate. The common substrate may include circuit traces for interconnecting the superconducting components with the non-superconducting components. A heat-shield may thermally separate the first end from the second end of the common substrate such that the superconducting components are configured to operate in a temperature range between 2 Kelvin to 77 Kelvin and the non-superconducting components are configured to operate in a temperature range between 200 Kelvin to 400 Kelvin. Each of the superconducting components may be configured to provide primarily a processor functionality and each of the non-superconducting components may be configured to provide primarily a storage functionality.

Computing system with superconducting and non-superconducting components located on a common substrate

An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.

Apparatus and method for providing a temperature-differential circuit card environment

A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.

Circuit card assembly and method of providing same

A system and method for transferring mail between containers in an orderly and secure manner. The system and method utilize ejection rods to lift mail from an input tray into a transfer box assembly that deposits the mail into an output tray in an orderly, stable and secure manner, ensuring that mail is not shuffled or lost during the transfer process.

System and method for transferring mail between containers

A storage tray for storing mail items in the sorting outlets of a mail sorting machine having a carousel with buckets that hold mail items and move in a transport direction such that the mail items describe an arcuate path when released from the buckets. The storage tray includes a bottom surrounded by side walls defining a horizontal top portion of the tray and a horizontal bottom portion of the tray, wherein the bottom of the tray includes a landing wall and a jogging wall intersecting in the bottom portion of the tray, the landing wall extending from the jogging wall in a first direction towards the top portion of the tray at an angle relative to the horizontal bottom portion of the tray, and the jogging wall extending away from the landing wall in a second direction along a generally arcuate curved path toward the top portion of the tray. The shape of the jogging wall preferably corresponds generally to the path of a mail item released from a bucket carousel of a sorting machine.

Rigid storage tray for flat and letter mail

The mail sorting systems and methods of the invention can be used to provide a mail carrier with a batch of mail that is arranged in delivery point order and separated by delivery point. Advantageously, the systems and methods employ an expandable, transportable container having a number of expandable compartments. Each expandable compartment holds the mail for a single delivery point.

System and method for delivery point packaging

A modular mail processing method and control system for sorting pieces of incoming, internal, and outgoing mail including a plurality of sorting bins which correspond to either mail stops or zip codes depending on which sort plan is selected. The modular mail processing method and control system permitting mixed pieces of mail of various sizes to be sorted. Additionally, an internal mail envelope, which has address regions consisting of blocks, may be utilized in connection with the modular mail processing method and control system in order to allow accurate detection of handwritten addresses.

Modular mail processing method and control system

A modular mail processing method and control system that includes a plurality of induction transport modules and a stacker/transport module. The system maintains a real time statistics concerning the mail flowing through the system. The modularity of the system increases its flexibility in adapting to sorting either incoming or outgoing mail. In addition, a variety of readers and printers can be employed in the system to meet the needs of a particular customer.

A transport/stacker module provides for a vertical stacking of mail bins. Carriers traveling in a transport path have openable and closable doors at both ends, and a frame of the transport/stacker module is provided with cam actuators to open the doors after the carriers pass turnaround areas and close the doors before the carriers enter the turnaround areas. A rake mechanism disposed above each bin is provided with a snubber which engages a mail piece prior to rake tines of the rake mechanism.

Transport/stacker module for mail processing system

Growing community of inventors

Ellicott City, MD, United States of America

Stanley Katsuyoshi Wakamiya