Taiwan Semiconductor Manufacturing Comp. Ltd.

Via Technologies, Inc.

Stanley John

Sandeep Kumar Goel

Ashok Mehta

Kai-Yuan Ting

Yun-Han Lee

Ji-Jan Chen

Yen-Hao Huang

Chao-Yang Yeh

Tze-Chiang Huang

David Fong

Zheng (Joy) Zhang

Qi (Christine) Chen

A clock distribution circuit configured to output a clock signal includes a first circuit configured to use a reference clock signal to provide first and second reference signals, wherein the second reference signal indicates whether the first reference signal is locked with the reference clock signal; a second circuit configured to use the reference clock signal to provide an output signal and an indication signal indicative whether the output signal is locked with the reference clock signal; and a monitor circuit, coupled to the first and second circuits, and configured to use at least one of the first reference signal, the second reference signal, the output signal, and the indication signal to determine whether the second circuit is functioning correctly.

Phase-locked loop monitor circuit

A method for dynamic frequency scaling (DFS) on the electronic systems level (ESL). The method can run in a virtual environment and dynamically scale the frequency of a virtual component based on a first transaction time and a second transaction time.

Dynamic frequency scaling

A device includes a fault generation circuit and a first fault injection circuit. The fault generation circuit is configured to generate a fault signal and a plurality of control signals according to a mode signal. The first fault injection circuit is configured to inject a first final fault signal to an under-test device based on the fault signal and the plurality of control signals, in order to verify robustness of the under-test device.

Device and method for robustness verification

A system comprises a processor-implemented tool configured to generate a layout of an integrated circuit (IC) die. At least one non-transitory machine readable storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second integrated circuit (IC) dies, respectively, and a second portion encoded with a second gate level description of the first and second circuit patterns received from the processor implemented tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented first verification module is provided for comparing the first and second gate level descriptions and outputting a verified second gate-level description of the first and second circuit patterns.

System and method for validating stacked dies by comparing connections

In some embodiments, in a method performed by at least one processor for estimating an overall power state coverage of an electronic system level (ESL) model comprising a plurality of blocks for a module, a first value and a second value are set for each block of said plurality of blocks. At least one verification case is selected for each block in the ESL model. For each verification case of said at least one verification case: (a) a target coverage value is set, (b) a register transfer level (RTL) simulation is performed, (c) an actual coverage value is received, and (d) the first value or the second value is updated based on whether the actual coverage value is less than the target coverage value or not. A power state coverage is calculated for said each block. The overall power state coverage is calculated for the ESL model comprising said plurality of blocks for said module.

Power state coverage metric and method for estimating the same

A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output ('IO') trace from a die verification test from a first format to a second format to improve performance.

System and method for functional verification of multi-die 3D ICs

A system and method is disclosed for functional verification and/or simulation of dies in a multi-die 3D ICs. The system and method include converting an I/O trace, embodied as a Value Change Dump, to one or more Universal Verification Methodology objects. This conversion aids in identify and fixing issues contained in die.

Format conversion from value change dump (VCD) to universal verification methodology (UVM)

A system includes an automated place and route tool to generate a layout of an integrated circuit (IC) die based on a gate level circuit description. A machine readable persistent storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second IC dies, respectively, and a second portion encoded with a second gate level description of the plurality of circuit patterns received from the tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented verification module is provided for comparing the first and second gate level descriptions and outputting an error report if the second gate level description has an error. The verification module outputs a verified second gate-level description of the first and second circuit patterns.

Stacked die interconnect validation

Included are embodiments of a description language program stored in a computing device for updating a first version of a computer program. In at least one embodiment, the first version of the computer program is written in a universal format and the program includes logic configured to receive an updated version of the computer program. Other embodiments include logic configured to retrieve the first version of the computer program and logic configured to translate the updated version of the computer program from a proprietary format to the universal format. Still other embodiments include logic configured to utilize at least one tag to compare the translated updated version of the computer program with the first version of the computer program.

Growing community of inventors

Fremont, CA, United States of America

Stanley John