International Business Machines Corporation

Rohm & Haas Electronic Materials LLC

Stanley J Jasne

Wayne Martin Moreau

Stephen L Buchwalter

Sushumna Iruvanti

Frank Louis Pompeo

Anson Jay Call

Paul Anthony Zucco

Neil D Brown

Nathaniel E Brese

Peter R Levey

Nell D Brown

UV curable compositions and methods for depositing one or more metal or metal alloy films on substrates are disclosed. The UV curable compositions contain a catalyst, one or more carrier particles, one or more UV curing agents, and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.

UV curable catalyst compositions

A C4 or flip chip reworkable electronic device is provided comprising an integrated circuit chip having conductive pads thereon which pads are electrically connected to corresponding pads on an interconnection substrate by solder connections, wherein the space between the chip and substrate is sealed using a specially defined thermoplastic resin such as polysulfone and polyetherimide.

Reworkable polymer chip encapsulant

A C4 or flip chip reworkable electronic device is provided comprising integrated circuit chip having conductive pads thereon which pads are electrically connected to corresponding pads on an interconnection substrate by solder connections, wherein the space between the chip and substrate is sealed using a specially defined thermoplastic resin such as polysulfone and polyetherimide.

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Yorktown, NY, United States of America

Stanley J Jasne