Texas Instruments Corporation

Stanley Chou

Steven Alfred Kummerl

Yuh-Harng Chien

Chih-Chien Ho

Frank Yu

Bo-Hsun Pan

Pi-Chiang Huang

An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.

Growing community of inventors

Taipei, Taiwan

Stanley Chou