Hon Hai Precision Industry Co., Ltd.

Foxconn Precision Components Co., Ltd.

Stanley Chen

Richard M Lee

Ken Lee

Yung-Chou Chen

Eric Su

Jeff Luo

Allen Tan

Hsien-Sheng Pei

Kai-Shing Hou

The present invention provides a heat dissipating device and a method for making the same. The heat dissipating device includes an aluminum flat base plate integrally forming a number of studs thereon, an aluminum folded fin with a number of inverted U-shaped heat dissipating fins connecting with each by bottom partitions. Each partition defines a number of holes. Thermal grease is uniformly spread on a bottom of each partition. In manufacturing the heat dissipating device, the folded fin is firstly mounted to the base plate to a position that the studs extend through the holes in the partitions. The studs are then subject to pressing operation to fixedly connect the folded fin and the base plate together, whereby the thermal grease entirely fill the gaps between the partitions and the base plate to enable heat absorbed by the base plate to be effectively dissipated by the inverted U-shaped heat dissipating fins.

Heat dissipating device and method making the same

A fan duct induces an air flow generated by a fan of a lower supply of a computer to flow simultaneously through at least two heat-generating components of the computer. The fan dut is formed by plastic injection molding to have a cuboidal configuration, defining a first opening in alignment with the fan, a second opening proximate a first heat-generating component, and a third opening proximate a second heat-generating component when the fan duct is mounted in the computer at a predetermined position. When the fan is operated in a direction to draw air from the computer, an air flow is generated to simultaneously flow through the two heat-generating components and into the fan duct via the second and third openings. The heated air is then expelled out of the fan duct via the first opening to reach an exterior of the computer.

Heat dissipation enhancing device

A fixing device for securing a heat sink to a CPU module includes a base plate, two elastic side plates respectively extending from two distal ends of the base plate, two curved portions formed between the base plate and the two elastic side plates for increasing elasticity of the fixing device when the two elastic side plates are expanded outward with respect to a central axis therebetween, two hooks respectively formed at free ends of the elastic side plates for securing to a backplane of the CPU module thereby sandwiching the heat sink between the fixing device and the CPU module, and two is engagement tabs respectively formed on the elastic side plates for allowance of an external tool to release the fixing device from the CPU module.

Fixing device for securing a heat sink to a CPU module

A cooling device for a CPU module includes an attachment plate fixed to the module and in contact with a CPU in the module. The attachment plate defines an elongate hole. A spring plate has two arms. A heat sink has a number of heat dissipating fins projecting from a base plate, wherein a portion of the fins have engaging teeth formed at free ends thereof. A mounting rod has a cross-slotted head and a tail formed with a locking tongue. A fan mounting plate is formed with two engaging teeth. A fan is screwed to the fan mounting plate. To assemble the cooling device, the locking tongue is extended through the spring, the heat sink and the elongate hole of the attachment plate and then rotated 90 degrees to engage an inner face of the attachment plate where the two arms of the spring are pressed to push the rod away from the heat sink whereby the heat sink and the attachment plate are fixedly connected. The mounting plate is then pressed onto the heat sink to cause the engaging teeth of the mounting plate to fixedly engage with the engaging teeth of the corresponding heat dissipating fins of the heat sink.

Cooling device for central processing unit module

A cooling device for a CPU consists of an attachment plate in contact with the CPU, a heat sink in contact with the attachment plate, a spring plate having two retention legs extending through the heat sink and the attachment plate, a fan mounting plate mounted with a fan and fixedly engaging with the heat sink and a mounting rod mounted between the fan mounting plate and the spring plate to compress the spring plate against the heat sink. The mounting rod is operable to move between first and second positions wherein at the first position, the mounting rod compresses the spring with a large force to cause the retention legs thereof to move away from each other and disengage with the attachment plate, and at the second position, the mounting rod compresses the spring plate with a small force to cause the retention legs thereof to move toward each other and engage with the attachment plate.

Growing community of inventors

Taipei, Taiwan

Stanley Chen