Lam Research Corporation

University of California

S & V Siu Associates, LLC

Lawrence Berkeley Laboratory

Stanley Chan Siu

James William Evans

Ricky Marsh

Jusson Koo

Zachary Andrew Siu

Vahid Vahedi

Roger Patrick

Juan Salas-Morales

Oliver M Newman

Juan C Salas-Morales

Luisarita Atzei

A method and apparatus are disclosed for assessing a respiratory function from plethysmography data obtainable, for example, from a pulse oximeter. A pulsatile waveform obtained from pleth data is processed to obtain a second waveform extending over multiple respiratory cycles and representing respiration-related variations in a pulse-beat area defined by the pulsatile waveform. The second waveform is analyzed to obtain information indicative of respiratory distress. A respiratory index that provides a good indicator of respiratory distress may be computed based on a magnitude of respiratory peaks in the second waveform. Applications to asthma and sleep apnea are described.

Method and apparatus for assessing respiratory distress

A method and apparatus are disclosed for assessing a respiratory function from plethysmography data obtainable, for example, from a pulse oximeter. A pulsatile waveform obtained from pleth data is processed to obtain a second waveform extending over a over multiple respiratory cycles and representing respiration-related variations in a pulse-beat area defined by the pulsatile waveform. The second waveform is analyzed to obtain information indicative of respiratory distress. A respiratory index that provides a good indicator of respiratory distress may be computed based on a magnitude of respiratory peaks in the second waveform. Applications to asthma and sleep apnea are described.

A method scales plasma process settings from a first processing device to a second processing device. The first processing device has a first geometry and a first set of process parameters. The second processing device has a second geometry and a second set of process parameters. A first set of plasma process settings that generates the first set of process parameters of the first processing device having the first geometry is determined. The first set of plasma process settings is reduced to isolate at least one variable on which the first set of plasma process settings depends on for each plasma process setting. A scaling factor is calculated for each plasma process setting from the first set of plasma process settings such that the first set of process parameters substantially equals the second set of process parameters. A second set of process settings is determined for the second processing device having the second geometry by multiplying each scaling factor with each plasma process setting from the first processing device having the first geometry.

Method for scaling processes between different etching chambers and wafer sizes

A probe for measuring properties of plasma includes a shell, a contact extending through the shell and having a first connecting portion positioned in the shell, and a connector guide attached to a second connecting portion, the second connecting portion being detachably coupled to the first connecting portion. In another embodiment, a probe for measuring properties of plasma includes a shell, a contact extending through the shell, wiring extending from the contact and along an interior of the shell, and a coolant inlet line for injecting coolant into the interior of the shell for cooling the wiring. A method for cooling wiring positioned in an interior of a probe includes providing a coolant inlet line for injecting coolant into the interior of the probe and inserting the coolant inlet line in the interior of the probe such that the coolant cools the wiring. A method for assembling a probe having a shell and a contact extending through the shell and having a first connecting portion positioned in the shell includes attaching a connector guide to a second connecting portion adapted for detachably coupling to the first connecting portion and inserting the second connecting portion and the connector guide into the shell of the probe such that the second connecting portion becomes detachably coupled to the first connecting portion, the connector guide being for aligning the second connecting portion with the first connecting portion.

Plasma probe and method for making same

A method in a high density plasma chamber for protecting a semiconductor substrate from charging damage from plasma-induced current through the substrate while etching through a selected portion of a conductive layer above the substrate. The method includes performing a bulk etch at least partially through the selected portion of the conductive layer using a first power setting for a plasma generating source of the high density plasma chamber. The method further includes performing a clearing etch through the selected portion of the conductive layer using a second power setting for the plasma generating source. In accordance with this embodiment, the second power setting is substantially minimized to reduce the charging damage.

Methods for reducing plasma-induced charging damage

Zinc metal is deposited from an alkali electrolyte solution onto conductive seed particles in an electrowinning process which yields unusually high current efficiency and low energy consumption.

Efficient electrowinning of zinc from alkaline electrolytes

A secondary zinc air cell, or another selected metal air cell, employing a spouted/packed metal particle bed and an air electrode. More specifically, two embodiments of a cell, one that is capable of being hydraulically recharged, and a second that is capable of being either hydraulically or electrically recharged. Additionally, each cell includes a sloped bottom portion to cause stirring of the electrolyte/metal particulate slurry when the cell is being hydraulically emptied and refilled during hydraulically recharging of the cell.

Hydraulically refueled battery employing a packed bed metal particle

Zinc metal is deposited on mobile seed particles in an electrowinning process. Exceptionally favorable results in terms of production rate, current efficiency and energy consumption are achieved by using a unique combination of design parameters and operating conditions achieved by selected ranges for particle size, current density, particle bed thickness, and acid content of the electrolyte.

Intense yet energy-efficient process for electrowinning of zinc in

A secondary metal air cell, employing a spouted/packed metal particle bed and an air electrode. More specifically a zinc air cell well suited for use in electric vehicles which is capable of being either electrically or hydraulically recharged.

Growing community of inventors

Castro Valley, CA, United States of America

Stanley Chan Siu