Imec Vzw

Katholieke Universiteit Leuven, Ku Leuven R&d

Panasonic Corporation

Katholieke Universiteit Leuven

Katholieke Universiteit Leuven, K.u. Leuven Research & Development

Stanislaw Piotr Zankowski

Philippe Vereecken

Philippe M Vereecken

Mitsuhiro Murata

Haruhiko Habuta

Maarten Mees

Nathalie Jeanne Hendrickx

Laurens Van Hoecke

At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.

Transforming a valve metal layer into a template comprising a plurality of spaced (nano)channels and forming spaced structures therein

Porous solid materials are provided. The porous solid materials include a plurality of interconnected wires forming an ordered network. The porous solid materials may have a predetermined volumetric surface area ranging between 2 m/cmand 90 m/cm, a predetermined porosity ranging between 3% and 90% and an electrical conductivity higher than 100 S/cm. The porous solid materials may have a predetermined volumetric surface area ranging between 3 m/cmand 72 m/cm, a predetermined porosity ranging between 80% and 95% and an electrical conductivity higher than 100 S/cm. The porous solid materials () may have a predetermined volumetric surface area ranging between 3 m/cmand 85 m/cm, a predetermined porosity ranging between 65% and 90% and an electrical conductivity higher than 2000 S/cm. Methods for the fabrication of such porous solid materials and devices including such porous solid material are also disclosed.

Porous solid materials and methods for fabrication

At least one embodiment relates to a method fabricating a solid-state battery cell. The method includes forming a plurality of spaced electrically conductive structures on a substrate. Forming the plurality of spaced electrically conductive structures on the substrate includes transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. Transforming at least part of the valve metal layer into the template includes a first anodization step, a second anodization step, an etching step in an etching solution, and a deposition step. The method also includes forming a first layer of active electrode material on the plurality of spaced electrically conductive structures, depositing an electrolyte layer over the first layer of active electrode material, and forming a second layer of active electrode material over the electrolyte later.

Fabrication of solid-state battery cells and solid-state batteries

The disclosure relates to a method for the fabrication of a thin-film solid-state battery with Ni(OH)electrode, battery cell, and battery. One example embodiment is a method for fabricating a thin-film solid-state battery cell on a substrate comprising a first current collector layer. The method includes depositing above the first current collector layer a first electrode layer. The first electrode layer is a nanoporous composite layer that includes a plurality of pores having pore walls. The first electrode layer includes a mixture of a dielectric material and an active electrode material. The method also includes depositing above the first electrode layer a porous dielectric layer. The method further includes depositing directly on the porous dielectric layer a second electrode layer. Depositing the second electrode layer includes depositing a porous Ni(OH)layer using an electrochemical deposition process.

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Growing community of inventors

Leuven, Belgium

Stanislaw Piotr Zankowski