Seagate Technology Incorporated

Stan Kassela

Weilu Hang Xu

Thomas Larson Greenberg

Robin Andrew Davies

Wei Xu

Antonio Javier Zambano

Lim Boon Leong

Liu Hao Jun

Chun Wai Tong

A sputtering apparatus includes a sputtering cathode and a target overlying the sputtering cathode. A shield overlies the target and forms an aperture configured to direct sputtering particles onto a substrate. The shield includes a lower shield portion overlying the target, a channel outlet overlying the lower shield portion, and an upper shield portion overlying the channel. In some embodiments the shield includes a first shield and a second shield. The first shield includes a front gas injection outlet. The second shield overlies the first shield and forms the aperture. In various embodiments, the second shield is operable to adjust plasma confinement between the first shield and the second shield.

Sputtering shield

Growing community of inventors

Singapore, Singapore

Stan Kassela