Applied Materials, Inc.

Stacy Meyer

Jeffrey P Schmidt

Douglas R McAllister

Trung Tri Doan

Steven M Zuniga

Hung Chih Chen

Charles C Garretson

Venkata R Balagani

Michael Jon Fong

Romain Beau De Lamenie

Aden Martin Allen

Jeonghoon Oh

Sidney P Huey

Danny Cam Toan Lu

James Chang Wang

Martin S Wohlert

Kerry F Hughes

Jian Lin

Young Jeen Paik

Ashish Bhatnagar

Padma Gopalakrishnan

Jay Rohde

William Ming-ye Lu

Aswathnarayanaiah Ravi

Abraham Palaty

Bopanna Ichettira Vansantha

Irfanulla Khuddus Rahmathullah

Wendell Glenn Boyd, Jr

Jamie Leighton

Christopher Richard Mahon

Wendell Glen Boyd, Jr

Daniel Martin

James Klingler

Daniel Cam Toan Lu

Trung T Doan

James C Wang

Romain Beau Delamenie

Jeffrey Schmidt

A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

Method of forming retaining ring with shaped surface

Embodiments of the present invention provide a polishing ring assembly suitable for polishing an electrostatic chuck and method of using the same. In one embodiment, the polishing ring assembly has a retaining ring assembly and an electrostatic chuck fixture. The retaining ring assembly includes an inner diameter and a top surface, a plurality of outer drive rings wherein the plurality of outer drive rings are placed on the top surface of the ceramic retaining ring. The electrostatic chuck fixture includes an electrostatic chuck drive plate adjacent to the inner diameter of in the ceramic retaining ring. The electrostatic chuck drive plate has a lock to secure retaining ring assembly with the electrostatic chuck fixture without transferring the weight from one assembly over to the other through the locking mechanism.

Polishing jig assembly for a new or refurbished electrostatic chuck

Retaining ring with shaped surface and method of forming

Method of polishing a new or a refurbished electrostatic chuck

Retaining ring with shaped surface

Retaining ring with Shaped Surface

A reinforcement ring is for placement in a carrier head to abut an inner surface of a perimeter portion of a flexible membrane. The reinforcement ring includes a substantially vertical cylindrical portion, a first flange projecting inwardly from the bottom of the cylindrical portion, and a second flange projecting outwardly from a bottom of the cylindrical portion. The second flange projects downwardly at a non-zero angle from vertical.

Reinforcement ring for carrier head

A carrier head includes a base, a substrate mounting surface, a retaining ring secured to the base, and a plurality of stacked shims located between the base and the retaining ring. The retaining ring has a bottom surface for contacting a polishing pad during polishing.

Carrier head with shims

A retaining ring includes a generally annular upper portion having a top surface configured to be connected to a base of a carrier head and a lower surface, and a plurality of substantially identical arcuate segments detachably secured to the upper portion to form an annular lower portion. Each of the arcuate segments has an upper surface that abuts the lower surface of the upper portion and a bottom surface for contacting a polishing pad during polishing.

Retaining ring with attachable segments

A retaining ring includes an annular lower portion and an annular upper portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, an inner rim projecting upward from the main body, an outer rim projecting upward from the main body and separated from the inner rim by a gap, and a plurality of azimuthally separated interlock features positioned between the inner rim and the outer rim, each interlock feature projecting upwardly from the main body. The annular upper portion has a top surface and a bottom surface and a plurality of azimuthally separated recesses in the bottom surface, the recesses defining thin portions of the upper portion, the plurality of interlock features fitting into the plurality of recesses. The lower portion is a plastic and the upper portion is a material that is more rigid than the plastic.

Two-part retaining ring with interlock features

A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the test wafer may be positioned using a positioner having a first plurality of test wafer engagement members positioned around the pedestal central wafer support surface. In another aspect, the wafer position may have a second plurality of test wafer engagement members positioned around an outer wafer support surface disposed around the pedestal central wafer support surface and adapted to support a test wafer. The second plurality of test wafer engagement members may be distributed about a second circumference of the ring member, the second circumference having a wider diameter than the first circumference. Additional embodiments and aspects are described and claimed.

Polishing head testing with movable pedestal

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San Jose, CA, United States of America

Stacy Meyer