Gould Electronics Inc.

Stacy A Riley

Thomas J Ameen

In one embodiment, the present invention relates to a method of treating metal foil including sequentially contacting the metal foil with a metal foil oxidizer solution containing water and at least about 7 ppm dissolved oxygen, contacting the metal foil with a chromium containing electrolytic bath and electrolyzing the bath, wherein the bath contains about 0.1 to about 5 g/l of a chromium compound, and contacting the metal foil with a silane solution containing from about 0.1 to about 10% v/v of a silane compound.

Adhesion enhancement for metal foil

In one embodiment, the present invention relates to a method of treating metal foil including sequentially contacting the metal foil with a first solution containing a metal foil oxidizer and less than about 5 g/l of a hydroxide compound, contacting the metal foil with a chromium containing electrolytic bath and electrolyzing the bath, wherein the bath contains about 0.1 to about 5 g/l of a chromium compound, and contacting the metal foil with a second solution containing from about 0.1 to about 10% v/v of a silane compound, with the proviso that the metal foil is not contacted with a reducing agent after contact with the first solution.

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Parma, OH, United States of America

Stacy A Riley