Hewlett-Packard Development Company, L.p.

Stacy A Fraker

Christian Laszlo Belady

Eric C Peterson

Brent A Boudreaux

Roy M Zeighami

Jeffrey L Deeney

Richard E Olson

Joseph D Dutson

Jill H Quinn

A pin shroud for a circuit board having a raised pin platform and a pin array projecting from the raised pin platform. A spacer extending from a side wall of the shroud engages a side of the raised pin platform, thereby accurately aligning the pin shroud with the pin platform.

Pin shroud

A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where the devices may not be co-planar due to tolerance stack-up. The pedestals may be raised and lowered and tilted as needed to match the heights and tilts of the electronic devices. Within the heat sink is a cavity above the pedestal that may be filled with a thermally conductive material, such as solder, or a thermally conductive liquid, during construction to create a low thermal resistance contact between the pedestal and the heat sink fins. Also, thermally conductive material, such as thermal paste or a thermal pad, may be used between the heat generating device and the pedestal to create a low thermal resistance contact.

Adjustable pedestal thermal interface

A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.

Heat-activated self-aligning heat sink

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Allen, TX, United States of America

Stacy A Fraker