Superconductor Technologies Inc.

Raytheon Company

Stacey M Bilski

James R Costa

Gregory Lynton Hey-Shipton

Elna Saito

Edward Robert Soares

George R Lehman

Ken S Ono

Steven W Miller

Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. The various systems and methods of the invention may include various ways of coupling, attaching, and/or connecting the various components of the system to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place so as to provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filters made of a high temperature superconductor material. A planar cable may be used for electrical connecting of components. These systems and devices may be used in, for example, wireless communication systems.

Systems and methods for simple efficient assembly and packaging of electronic devices

RF switches and methods of use are provided. In one embodiment, a RF switch includes first and second switch assemblies, each comprising an elongate member and a magnetic housing on an end of the member. The magnet is disposed between contact pads for first and second circuits, and an electromagnetic source is coupled to the assemblies. Each switch has a first and second state. Another RF switch of the present invention includes a rotor, an elongate member disposed centrally through the rotor, an actuator coupled to the member and configured to rotate the member and the rotor, and a contact on the rotor that may touch a substrate. The contact is used to complete a first path or a second path.

RF receiver switches

A package for electronic components, especially MMIC components, is disclosed. The package is constructed from layers of ceramic cofired to form an annular piece. Metal pieces are brazed onto the top and bottom of the annular piece to hermetically seal the package. Certain of the ceramic pieces are coated with patterns of conductive material before cofiring. The conductive material forms DC power distribution lines to electronic components within the package and low loss RF feedthroughs into the package.

MMIC package and connector

Growing community of inventors

Santa Barbara, CA, United States of America

Stacey M Bilski