Abb Research Ltd.

Abb Technology Ag

Abb Schweiz Ag

Abb Power Grids Switzerland Ag

Stéphane Schaal

Bruno Agostini

Benjamin Weber

Jens Tepper

Jens Rocks

Uwe Kaltenborn

Marcos Bockholt

Lise Donzel

Martin Carlen

Xavier Kornmann

Bandeep Singh

Burak Esenlik

Jasmin Smajic

Patrick Meier

Thorsten Steinmetz

Guido Meier

Jong-Yun Lim

Dieter Stoll

Armin Piur

Prateek Puri

Cherif Ghoul

Patricia Gonzalez

Francisco Arauzo

Exemplary embodiments are directed to a heat exchanger system for transformers or reactors having at least one coil being cooled by gaseous fluids circulating around the transformer. The system having an enclosure that houses the transformer and the at least one coil, where flow of cooling gaseous fluid passes over the coil and is heated by the heat of the transformer or reactor the heated gas is directed to pass over a thermosiphon heat exchanger which dissipates the heat to a cooling media.

Heat exchanger system for dry-type transformers

Mold-free resin-insulated coil windings are obtained by applying continuous fibers embedded in a quasi-solid-state epoxy-resin matrix, e.g. in the form of a tape, to the coil windings. The tape is locally heated up to the melting point of its polymer matrix, and is subsequently pressed against the winding body. The heated and fused resin of the tape, which is pressed onto the coil, flows under pressure into the voids and gaps between the coil windings and fills them up, thereby hermetically insulating the coil windings. After leaving the heating and pressing apparatus the fused epoxy resin becomes solid again. The resulting curing process is thus considerably simplified and shortened, compared to the state of the art.

Mold-free resin-insulated coil windings

A curable epoxy resin composition including at least an epoxy resin component and a hardener component, and optionally further additives, wherein: (a) the epoxy resin component is an epoxy resin compound or a mixture of such compounds; (b) the hardener component includes (b1) an aliphatic and cycloaliphatic or aromatic polycarbonic acid anhydride; and (b2) a polyether-amine of the general formula (I), HN&#x2014;(CH&#x2014;O)&#x2014;CH&#x2014;NH, wherein n is an integer from 2 to 8; and m is from about 3 to about 100; (c) the polycarbonic acid anhydride [component (b1)] is present in the curable epoxy resin composition in a concentration of 0.60 Mol to 0.93 Mol; and (d) the polyether-amine of the general formula (I) [component (b2)] is present in the curable epoxy resin composition in a concentration of about 0.02 Mol to about 0.1 Mol.

Curable epoxy resin composition

Growing community of inventors

Sierentz, France

Stéphane Schaal