Hewlett-Packard Development Company, L.p.

Other

Sriram Ramamoorthi

Zhizhang Chen

Paul J Benning

Ronald L Enck

Thomas Eugene Novet

Timothy F Myers

Peter Mardilovich

Donald J Milligan

John Liebeskind

Jennifer Shih

Chien-Hua Chen

Alexander N Govyadinov

Qin Liu

Terry E McMahon

Michael John Regan

Hang Liao

Xiaofeng Yang

Galen H Kawamoto

Mark Alan Johnstone

Brian E Bolf

Pavel Kornilovich

Gregory Scott Herman

Manish Giri

Arthur Piehl

Jeremy Harlan Donaldson

Martha A Truninger

Robert W Shreeve

Timothy R Emery

Joshua M Yu

George Z Radominski

Siddhartha Bhowmik

Mark Sanders Taylor

Hung Liao

Steve P Hanson

Harold Lee Van Nice

Swaroop K Kommera

Mark David Johnson

J Daniel Smith

David M Braun

John Chen

Daniel C Gardner

Richard J Oram

Alexander Govyandinov

Paval Kornilovich

A method of forming a micro-electro mechanical system (MEMS), includes (1) removing material from a first wafer to define a first movable portion corresponding to an x-y accelerometer and a second movable portion corresponding to a z accelerometer, where each movable portion comprises at least one flexure member and at least one proof mass, each proof mass and flexure member being formed by the selective removal of material from a top side and a bottom side of first wafer; (2) bonding the first wafer to a second wafer comprising an electronic circuit, such that a gap is defined between the first wafer and the second wafer. The thickness of the at least one flexure member of the first movable portion is independent of a thickness of the at least one flexure member of the second movable portion and a thickness of the proof mass of the first movable portion is independent of a thickness of the at least one proof mass of the second movable portion.

Forming a micro electro mechanical system

A slot is formed that reaches through a first side of a silicon substrate to a second side of the silicon substrate. A trench is laser patterned. The trench has a mouth at the first side of the silicon substrate. The trench does not reach the second side of the silicon substrate. The trench is dry etched until a depth of at least a portion of the trench is extended approximately to the second side of the silicon substrate (). A wet etch is performed to complete formation of the slot. The wet etch etches silicon from all surfaces of the trench.

Formation of a slot in a silicon substrate

Embodiments of a micro electro mechanical system are disclosed.

Micro electro mechanical system

This disclosure describes system(s) and/or method(s) enabling contacts for individual nanometer-scale-thickness layers of a multilayer film.

Multilayer film with stack of nanometer-scale thicknesses

This disclosure relates to misalignment-tolerant processes for fabricating multiplexing/demultiplexing architectures. One process enables fabricating a multiplexing/demultiplexing architecture at a tolerance greater than a pitch of conductive structures with which the architecture is capable of communicating. Another process can enable creation of address elements and conductive structures having substantially identical widths.

Misalignment-tolerant methods for fabricating multiplexing/demultiplexing architectures

This disclosure relates to misalignment-tolerant multiplexing/demultiplexing architectures. One architecture enables communication with a conductive-structure array having a narrow spacing and pitch. Another architecture can comprise address elements having a width substantially identical to that of conductive-structures with which each of these address elements is capable of communicating. Another architecture can comprise rows of co-parallel address elements oriented obliquely relative to address lines and/or conductive structures.

Misalignment-tolerant multiplexing/demultiplexing architectures

A vacuum device, including a substrate and a support structure having a support perimeter, where the support structure is disposed over the substrate. In addition, the vacuum device also includes a non-evaporable getter layer having an exposed surface area. The non-evaporable getter layer is disposed over the support structure, and extends beyond the support perimeter, in at least one direction, of the support structure forming a vacuum gap between the substrate and the non-evaporable getter layer increasing the exposed surface area.

Vacuum device having non-evaporable getter component with increased exposed surface area

A method is disclosed for forming a single crystal cantilever and tip on a substrate. The method can include the operation of defining an implant area on the substrate with a layer of photoresist. A further operation can be implanting oxygen into the substrate in the implant area to a predetermined depth to form a buried oxide layer. The buried oxide layer can define a bottom of the single crystal cantilever and tip. Another operation can involve shaping the single crystal cantilever and tip from the substrate above the buried oxide layer.

Method for forming a cantilever and tip

One embodiment of a display system includes a first array that defines multiple reflective devices each movable between an inactive position to reflect light to a light dump and an active position to reflect light to an imaging region, a second array that defines multiple reflective devices each movable between an inactive position to reflect light to the light dump and an active position to reflect light to the imaging region, and an activation device that projects an activation beam to the devices to move individual ones of the devices between the active position and the inactive position, wherein the first array, the second array and the activation device are housed within a single vacuum enclosure.

Display system

A vacuum micropump for use in a sealed package includes at least one pumping cell and a magnetic field proximate to the pumping cell. The pumping cell has at least one anode, at least one dielectric in contact with the at least one anode, at least one titanium cathode in contact with the dielectric and an electric field between the at least one anode and the at least one cathode. The dielectric defines a space between the at least one anode and the at least one cathode. The vacuum micropump may be used to gauge pressure within the sealed package. An appropriate method of use is also provided.

Vacuum micropump and gauge

Method of forming multilayer film

A system for sensing a property of a fluid comprises a fluid channel operable to receive the fluid therein, a flexible arm having a free end positioned within at least a portion of the fluid channel, a fluid actuator disposed sufficiently close to the flexible arm such that actuation of the fluid actuator induces movement of the flexible arm when the fluid is present, and a deflection sensing system operable to quantifiably detect movement of the flexible arm.

Cantilevers for sensing fluid properties

An antireflection surface formed using a plurality of nanostructures of a first material on a surface of a second material. The first material is different from the second material. The distribution of spatial periods of the nanostructures is set by a self-assembly operation. The surface of the second material is converted to operate as a graded index surface that is substantially antireflective for the wavelength of interest.

Nanostructure antireflection surfaces

A MEMS device includes at least one movable member and an active device having at least one property affected by the location of the movable member with respect to the active device. A control circuit is used to limit movement of the movable member based on observation of the property affected by the active device.

MEMs device with feedback control

A photonic crystal device is fabricated by a method comprising steps of providing a substrate, providing a photonic crystal on the substrate, and etching a cavity under at least the photonic crystal, the cavity having an inner wall adapted to reflect light.

Photonic crystal device and methods

Growing community of inventors

Corvallis, OR, United States of America

Sriram Ramamoorthi