Sandisk Technologies Inc.

Srinivasan Sivaram

Nagesh K Vodrahalli

Shrikar Bhagath

Rama Shukla

Chih Yang Li

A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level. These die pairs are formed using wafer-to-wafer bonding technology, where the wafers may be bonded to each other when they are of full thickness. The semiconductor device may further include a CMOS logic circuit as part of the pair of semiconductor dies or in its own semiconductor die mounted to the pair of semiconductor dies.

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Los Gatos, CA, United States of America

Srinivasan Sivaram