International Business Machines Corporation

Srinivasa Sn Reddy

Charles Leon Arvin

Gareth Geoffrey Hougham

Eric D Perfecto

Krystyna Waleria Semkow

Brian Richard Sundlof

Kamalesh K Srivastava

Peter Jeffrey Brofman

Donald W Henderson

Julien Sylvestre

Hsichang Liu

Renee L Weisman

Alexandre Blander

In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.

Additives for grain fragmentation in Pb-free Sn-based solder

Growing community of inventors

Bengaluru, India

Srinivasa Sn Reddy