Infineon Technologies Ag

Srinivasa Reddy Yeduru

Francisco Javier Santos Rodriguez

Stefan Woehlert

Karl Mayer

Karl Heinz Gasser

Joachim Hirschler

Harald Wiedenhofer

Franz Kleinbichler

A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer.

Method for processing a wafer and wafer structure

In various embodiments, a method of processing a semiconductor device may include providing a semiconductor device comprising a contact pad and a polymer layer; and subjecting at least a part of the contact pad and the polymer layer to a plasma comprising ammonia.

Method of processing a semiconductor device and chip package

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Villach, Austria

Srinivasa Reddy Yeduru