Gm Cruise Holdings LLC

Srinivasa Rao Damaraju

Zoran Stefanoski

Reza Azizian

Kaida Chen

Robert Y Cao

Brian Schlotterbeck

Yung Chang Ko

Jameson Tai

Cathy Yoon

Various technologies described herein pertain to a sensor for an autonomous vehicle that includes one or more heat dissipation features. A sensor includes a top cover and a bottom cover, where the top cover and the bottom cover form at least a portion of a casing of the sensor. The sensor includes a coldplate, a first printed circuit board, and a second printed circuit board. A top side of the first printed circuit board is coupled to the top cover and a bottom side of the first printed circuit board is coupled to a top side of the coldplate. A top side of the second printed circuit board is coupled to a bottom side of the coldplate and a bottom side of the second printed circuit board is coupled to the bottom cover. Various features described herein enhance heat transfer from components on the first and second printed circuit boards.

Heat dissipation features of autonomous vehicle sensor

Various technologies described herein pertain to a heat spreader for an autonomous vehicle computing device. The heat spreader includes a top surface, a bottom surface, and a side surface. The top surface of the heat spreader is thermally conductive. The top surface of the heat spreader includes a section that is sized and shaped to align with a heat generating component (e.g., on a printed circuit board assembly). The top surface of the heat spreader is configured to receive heat from the heat generating component. The bottom surface of the heat spreader includes externally integrated fins. The heat spreader is configured to dissipate the heat from the heat generating component such that the heat from the heat generating component flows from the top surface to the externally integrated fins on the bottom surface.

Heat spreader with integrated fins

Various technologies described herein pertain to an autonomous vehicle computing device for an autonomous vehicle. The autonomous vehicle computing device includes a printed circuit board, a heat sink, and a thermal interface material layer between the printed circuit board and the heat sink. The autonomous vehicle computing device further includes a barrier layer between the thermal interface material layer and the printed circuit board. The thermal interface material layer can be formed of a two-part thermal interface material that cures in place. The barrier layer between the thermal interface material layer and the printed circuit board enables separation of the printed circuit board from the thermal interface material layer if reworking or modification of the autonomous vehicle computing device is desired. The barrier layer can enable the printed circuit board to be separated from the thermal interface material layer in a manner that mitigates damage to the printed circuit board.

Autonomous vehicle computing device with barrier layer

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San Francisco, CA, United States of America

Srinivasa Rao Damaraju