Intel Corporation

Srinivas Venkata Ramanuja Pietambaram

Kristof Darmawikarta

Rahul N Manepalli

Jeremy D Ecton

Tarek A Ibrahim

Brandon C Marin

Dilan Seneviratne

Hiroki Tanaka

Bai Nie

Benjamin Duong

Hari Mahalingam

Aleksandar Aleksov

Robert L Sankman

Robert Alan May

Nasser A Kurd

Pooya Tadayon

Yonggang Li

Leonel R Arana

Gang Duan

Javier Soto Gonzalez

Dingying David Xu

Mohamed A Abdelmoneum

Brent R Carlton

Praneeth Kumar Akkinepally

Xiaoying Guo

Changhua Liu

Kyle Jordan Arrington

Bharat P Penmecha

Meizi Jiao

Jung Kyu Han

Yosuke Kanaoka

Jason A Mix

Whitney Michael Bryks

Oscar Ojeda

Hongxia Feng

Jesse Jones

Eduardo Alban

Sashi S Kandanur

Haobo Chen

Eric J M Moret

Roy Dittler

Shruti Rajeev Jaywant

Bohan Shan

Rajat Goyal

Yue Deng

Wei Wei

Sarah Shahraini

Santosh Tripathi

Rajeev Ranjan

An electronic device and associated methods are disclosed. In one example, the electronic device includes a MEMS die located within a substrate, and below a processor die. In selected examples, the MEMS die includes a resonator. Example methods of forming MEMS resonator devices are also shown.

Integrated MEMS resonator and method

An electro-optical system having one or more electro-optical devices integrally formed within a substrate and associated methods are disclosed. An electro-optical system including an electro-optic switch is shown. An electro-optical system including an electro-optic modulator is shown. An electro-optical system including an optical resonator is shown.

Glass interposer optical switching device and method

Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.

Omni directional interconnect with magnetic fillers in mold matrix

Various embodiments disclosed relate to photonic assemblies. The present disclosure includes methods for packaging a photonic assembly, including attaching a bridge die to a glass substrate, attaching an electronic integrated circuit die to the glass substrate and the bridge die, attaching a photonic integrated circuit die to the glass substrate and the bridge die, bonding a coupling adapter to the glass substrate and in situ forming a waveguide in the coupling adapted, the waveguide aligning with the photonic integrated circuit die.

Die last and waveguide last architecture for silicon photonic packaging

In an optical circuit, a substrate can define a cavity that extends into a substrate front surface. A sidewall of the cavity can include a substrate optical port. An optical path can extend through the substrate from a connector optical port to the substrate optical port. A photonic integrated circuit (PIC) can attach to the substrate. A PIC front surface can include a plurality of electrical connections. A PIC edge surface can extend around at least a portion of a perimeter of the PIC between the PIC front surface and a PIC back surface. A PIC optical port can be disposed on the PIC edge surface and can accept or emit an optical beam along a PIC optical axis. The PIC optical axis can be aligned with the substrate optical port when the PIC is attached to the substrate.

Optical circuit with optical port in sidewall

Glass interposer optical resonator device and method

Microelectronic devices including an embedded die substrate including a molded component formed on or over a surface of a laminated substrate that provides a planar outer surface independent of the contour of the adjacent laminated substrate surface. The molded component may be formed over at least a portion of the embedded die. In other examples, the molded component and resulting planar outer surface may alternatively be on the backside of the substrate, away from the embedded die. The molded component may include an epoxy mold compound; and may be formed through processes including compression molding and transfer molding.

Embedded die microelectronic device with molded component

Various examples provide a semiconductor patch. The patch includes a glass core having first and second opposed major surfaces extending in an x-y direction. The patch further includes a conductive via extending from the first major surface to the second major surface substantially in a z-direction. The patch further includes a bridge die embedded in a dielectric material in communication with the conductive via. The patch further includes an overmold at least partially encasing the glass core.

Embedded die architecture and method of making

Disclosed is an embedded multi-die interconnect bridge (EMIB) substrate. The EMIB substrate can comprise an organic substrate, a bridge embedded in the organic substrate and a plurality of routing layers. The plurality of routing layers can be embedded within the bridge. Each routing layer can have a plurality of traces. Each of the plurality of routing layers can have a coefficient of thermal expansion (CTE) that varies from an adjacent routing layer.

Molded embedded bridge including routing layers for enhanced EMIB applications

Apparatus and methods are provided for flexible and stretchable circuits. In an example, a method can include forming a first flexible conductor on a substrate, the first flexible conductor including a first conductive trace surrounded on three sides by a first dielectric, and forming a second flexible conductor on top of the first flexible conductor, the first flexible conductor located between the second flexible conductor and the substrate, the second flexible conductor including a second conductive trace surrounded by a second dielectric.

Method for making a flexible wearable circuit

Growing community of inventors

Chandler, AZ, United States of America

Srinivas Venkata Ramanuja Pietambaram