Intel Corporation

Srinivas Thota

Sanjeev S Jahagirdar

Sandeep K Venishetti

Chung-Hao Chen

Wei Qian

Chi-Te Chen

Long Wang

Xing Jian Cai

Jue Chen

Su Mi Sam

Yihong Yang

Some embodiments include apparatuses and electrical models associated with the apparatus. One of the apparatuses includes an integrated circuit having a die; a package substrate; first conductive connections coupled between the die and a first side of the package substrate; second conductive connections located on a second side of the package substrate opposite from the first side. The second conductive connections are coupled to the first conductive connections through conductive paths in the package substrate. The first conductive connections and the conductive connections are associated with an S-parameter of an electrical model of the integrated circuit package. The electrical model further includes at least one of a current value associated with a power rail of the integrated circuit package, an impedance target associated with a location at the integrated circuit package, and a mapping associated with the first and second conductive connections.

Platform power integrity design including package standard power integrity model and compact voltage regulator module model

An apparatus includes a distribution network that includes circuitry configured to receive first power from a first voltage source and second power from a second voltage source, and to deliver power to each of a plurality of electronic circuitry blocks (ECBs), including to deliver first ECB power to a first ECB and second ECB power to a second ECB. The first ECB power includes a first portion of the first power and a first portion of the second power. The apparatus also includes power management logic to dynamically adjust the power to be provided to each ECB. Responsive to a change in a first activity level of the first ECB, the power management logic is to change the first ECB power by adjustment of the first portion of the first power and adjustment of the first portion of the second power. Other embodiments are described and claimed.

Configurable power supplies for dynamic current sharing

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El Dorado Hills, CA, United States of America

Srinivas Thota