Ge Lighting Solutions LLC

Lumination LLC

Gelcore, LLC

Srinath K Aanegola

Emil Vergilov Radkov

Matthew S Mrakovich

James Thomas Petroski

James Reginelli

Tomislav Josip Stimac

Christopher L Bohler

Larry R Stadelman

Stanton Earl Weaver, Jr

Paul Southard

Boris Kolodin

Anant Achyut Setlur

Xin Wang

Thomas Frederick Soules

Jeffrey Marc Nall

Koushik Babi Saha

Ivan Eliashevich

Mathew L Sommers

Kevin Carpenter

Stanton E Weaver

Zena Brown

Michael Hsing

Michael McCoy

Paul W Southard

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Light emitting diode component

A light source () comprises a light engine (), a base (), a power conversion circuit () and an enclosure (). The light engine () comprises at least one LED () disposed on a platform (). The platform () is adapted to directly mate with the base () which a standard incandescent bulb light base. Phosphor () receives the light generated by the at least one LED () and converts it to visible light. The enclosure () has a shape of a standard incandescent lamp.

LED-based light bulb

A white light hybrid illumination system including an amber LED, a red LED, and a phosphor converted LED such as a blue LED chip and a green phosphor, wherein a peak emission difference between the amber and red LED is at least 25 nm. This system provides higher color quality than prior devices due to its high luminous efficacy, high CRI over a wide CCT range, and better color control.

Hybrid illumination system with improved color quality

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.

Provided are a lighting device, a backlighting device, and a display device that comprise a radiation source such as LED and wavelength converting members comprising phosphors. In one embodiment, self-absorption within the devices is suppressed or reduced by placing a selective reflector between two wavelength converting members, and the wavelength converting member emitting light with longer peak wavelength is substantially isolated from the irradiation of another wavelength converting member emitting light with shorter peak wavelength. In other embodiments, the wavelength converting members are arranged in strip configuration; or in adjacent hexagons configuration.

Lighting device having illumination, backlighting and display applications

An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly.

Environmentally robust lighting devices and methods of manufacturing same

In a light emitting package (), at least one light emitting chip () is supported by a board (). A light transmissive encapsulant () is disposed over the at least one light emitting chip and over a footprint area () of the board. A light transmissive generally conformal shell () is disposed over the encapsulant and has an inner surface () spaced apart by an air gap (G) from, and generally conformal with, an outer surface () of the encapsulant. At least one phosphor () is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell () is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m&#xb7;K).

Light emitting packages and methods of making same

An illuminated sign () includes a flexible electrical power cord () including first and second parallel conductors () surroundingly contained within an insulating sheath defining a constant separation distance between the parallel conductors (). A plurality of light emitting diode (LED) devices () are affixed to the cord (). Each LED device () includes an LED () having a positive lead () electrically communicating with the first parallel conductor () and a negative lead () electrically communicating with the second parallel conductor (). A stencil () defines a selected shape, and the electrical cord () is arranged on the stencil (). Power conditioning electronics () disposed away from the stencil () electrically communicate with the first and second parallel conductors () of the electrical power cord (). The power conditioning electronics () power the LED devices () via the parallel conductors ().

Flexible lighting strips employing light-emitting diodes

In a light emitting device, a light emitting chip () includes a stack of semiconductor layers () and an electrode () disposed on the stack of semiconductor layers. A support () has a generally planar surface () supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material () is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (') of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.

Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip

Illuminated signage employing light emitting diodes

A light emitting package () includes a printed circuit board () supporting at least one light emitting die (). A light transmissive cover () is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter () connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume () containing the at least one light emitting die. An encapsulant () is disposed in the interior volume and covers at least the light emitting die.

Growing community of inventors

Broadview Heights, OH, United States of America

Srinath K Aanegola