Kla Tencor Corporation

Srikanth Kandukuri

Thirupurasundari Jayaraman

Prasanti Uppaluri

Raghav Babulnath

Gangadharan Sivaraman

Lisheng Gao

Kenong Wu

Santosh Bhattacharyya

Sagar A Kekare

Gordon Rouse

Ankit Jain

Ardis Liang

Vidyasagar Anantha

Raghavan Konuru

Satya Kurada

Pavan Kumar

Rahul Lakhawat

Aravindh Balaji

Karthikeyan Subramanian

Anil Raman

Praveen Gunasekaran

Manikandan Mariyappan

Methods and systems for creating a sample of defects for a specimen are provided. One method includes detecting defects on a specimen based on output generated by a detector of an output acquisition subsystem. For the defects detected in an array region on the specimen, where the array region includes multiple array cell types, the method includes stacking information for the defects based on the multiple array cell types. The stacking includes overlaying design information for only a first of the multiple array cell types with the information for only the defects detected in the first of the multiple array cell types. In addition, the method includes selecting a portion of the detected defects based on results of the stacking thereby creating a sample of the detected defects.

Creating defect samples for array regions

Systems and methods are disclosed for storing dynamic layer content in a design file. A design file is received having design data corresponding to a plurality of process layers. A geometric operation formula is also received. A processor generates a polygon having dynamic layer content that is formed by applying the geometric operation formula on two or more of the plurality of process layers. The updated design file is stored, the design file now having a polygon having dynamic layer content.

Methods to store dynamic layer content inside a design file

A method for automatically classifying one or more defects based on electrical design properties includes receiving one or more images of a selected region of a sample, receiving one or more sets of design data associated with the selected region of the sample, locating one or more defects in the one or more images of the selected region of the sample by comparing the one or more images of the selected region of the sample to the one or more sets of design data, retrieving one or more patterns of interest from the one or more sets of design data corresponding to the one or more defects, and classifying the one or more defects in the one or more images of the selected region of the sample based on one or more annotated electrical design properties included in the one or more patterns of interest.

System and method for defect classification based on electrical design intent

Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.

Sub-pixel alignment of inspection to design

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Hyderabad Telangana, India

Srikanth Kandukuri