Semiconductor Technologies & Instruments Pte. Ltd.

Asti Corporation

Asti Holdings Limited

Sreenivas Rao

Noor Ashedah Binti Jusoh

Tan Seow Hoon

Wong Soon Wei

Satish Kaveti

Seow Hoon Tan

Ashedah Binti Jusoh

A system for inspecting components is provided. The system includes a CMOS imaging system generating image data, such as pixel data from a pixel array. An image analysis system is connected to the CMOS imaging system, the image analysis system receiving the image data and generating image analysis data. The CMOS imaging system generates the image data at a rate that allows the CMOS imaging device to be used for inspecting components.

CMOS inspection apparatus

A semiconductor lead inspection device includes a camera and an illumination source for backlighting the leads of the semiconductor device to form an image in the camera. The camera and the illumination device are arranged on optical paths which alternatively pass through or are reflected by a beamsplitter. A surface is illuminated to backlight the leads and a light deflecting device is arranged for deflecting the backlit image of the semiconductor leads to form an image in the camera.

3-D lead inspection

A system for inspecting a component is provided. The system includes an imaging system, such as a digital camera. A controller is connected to the digital camera. The controller receives the digital image data of a device that is generated by the camera. The controller processes the digital image data to generate control commands. A variable grid generation system is also connected to the controller. The variable grid generation system can receive commands from the controller, and can generate a grid in response to the commands that matches the component and that allows the component to be inspected.

3D profile analysis for surface contour inspection

A variable intensity lighting system for use with a machine vision apparatus for capturing high contrast images of articles to be inspected, such as semiconductor packages, includes an LED or optical fiber element and flash lamp array configured in multiple segments which are operable to be controlled as to light output intensity by a programmable intensity control circuit operably connected to a microprocessor. The intensity control circuit includes multiple digital potentiometers operable to control selected segments of the lighting array. The control circuit is adapted to control up to 64 segments of the lighting array individually at 64 incremental intensity levels, respectively. The control circuit may include a light failure module to detect a segment failure or a reversed connection. A processor is programmed to calculate a median gray value from a predetermined number of camera pixel intensity values of the article being viewed under the lighting array to readjust the intensity of the lighting until a setting with suitable contrast is reached. Each article being viewed may have a suitable identifier, such as a dimple or notch which is viewed by the camera to determine the optimum intensity level.

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Singapore, Singapore

Sreenivas Rao