Nvidia Corporation

Sreedhar Pratty

Haoxing Ren

Muhammad Arif Mirza

Shaurakar Das

SeshasaiJyothi Kolli

Santosh Santosh

David Lyndell Brown

To ensure proper operation (e.g., speed and/or function) of standard cells fabricated within an integrated circuit a minimum potential difference between the high and low power supply rails needs to be maintained. IR drop refers to a reduction in the potential difference between the power supply rails and is caused when the switching activity of cells that share a power supply rail is greater than can be provided at a particular time. Before fabrication, placement of the cells is reorganized within bounding box regions. Power density across the power rails within each bounding box is normalized based on spatial and temporal power density characteristics of each cell. The reorganization is IR aware and has minimal impact on timing and IR drop is mitigated because distributing current consumption between the supply rails reduces current spikes and IR drops.

Rail power density aware standard cell placement for integrated circuits

A computer-implemented method for designing an integrated circuit includes determining a timing slack associated with a first cell of the integrated circuit that is physically adjacent to a second cell of the integrated circuit, the second cell including an implant region that is in violation of an implant width design rule associated with the integrated circuit, determining that the timing slack is greater than a change in timing slack associated with expanding the implant region into the first cell, and, in response, expanding the implant region from first cell into the second cell to form a larger implant region.

Modifying implant regions in an integrated circuit to meet minimum width design rules

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Santa Clara, CA, United States of America

Sreedhar Pratty