Semiconductor Components Industries, LLC

Sravan Vanaparthy

Chee Hiong Chew

Yusheng Lin

Vemmond Jeng Hung Ng

Yushuang Yao

Jinchang Zhou

Chuncao Niu

Asif Jakwani

Silnore Tejero Sabando

A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stub that extends on to the front surface of the power electronic substrate. The method further includes welding the at least one terminal stub to at least one circuit trace disposed on the front surface of the power electronic substrate.

Power module

Implementations of power modules may include: a substrate having a first side and a second side. The power module may include a plurality of leads coupled to a second side of the substrate and a molding compound over a portion of five or more surfaces of the substrate. The power module may also include an opening extending from a first side of the substrate to an outer edge of the molding compound. The opening may be configured to receive a coupling device and the coupling device may be configured to couple with a heat sink or a package support.

Quad leadframe packages and related methods

Growing community of inventors

Scottsdale, AZ, United States of America

Sravan Vanaparthy