Tyco Electronics Corporation

Spencer Viray

Sidharth Dalmia

Steven R Kubes

Khanh Nguyen

Lee Harrison

Jess Kerlin

A method for manufacturing a planar electronic device includes applying a non-conductive fluid polymer to a lower side of a planar substrate. The substrate includes a hole extending through the substrate. The method also includes curing the fluid polymer to form a solid centering layer on the lower side of the substrate, with the centering layer extending across the hole along the lower side of the substrate. The method further includes loading a ferrite material body into the hole of the substrate through the upper side of the substrate, embedding the ferrite material body in an encapsulating material in the hole, and forming one or more conductive loops around the ferrite material body. The ferrite material body is held within the substrate between the lower side and the upper side of the substrate by the encapsulating material.

Growing community of inventors

Sacramento, CA, United States of America

Spencer Viray