Canon Kabushiki Kaisha

Canon Kabishiki Kaisha

Souta Takeuchi

Yoshiyuki Imanaka

Takaaki Yamaguchi

Takuya Hatsui

Kousuke Kubo

Takahiro Matsui

Koichi Omata

Masaya Uyama

Soichiro Nagamochi

Hirokazu Komuro

Muga Mochizuki

Kenji Takahashi

Takeru Yasuda

Masataka Kato

Toru Nakakubo

Sadayoshi Sakuma

Tomohiro Takahashi

Shuichi Tamatsukuri

Kazuaki Shibata

Makoto Sakurai

Shinya Iwahashi

Jiro Moriyama

Yuzuru Ishida

Mineo Kaneko

Yoshinori Tagawa

Yoshinori Nakajima

Masafumi Wataya

Taichi Yonemoto

Takumi Shimoda

Keiji Watanabe

Mineo Shimotsusa

Kazuhiro Asai

Atsunori Terasaki

Hiroyuki Murayama

Hiraku Kozuka

Makoto Watanabe

Souhei Tanaka

Yukihiro Hayakawa

Hiroto Komiyama

Kei Fujita

Takashi Morii

Atsushi Teranishi

Mitsunori Toshishige

A method for manufacturing an element substrate of a liquid ejection head, the method includes forming a silicon-based film layer including carbon on one surface of a base substrate, laminating a silicon substrate on the film layer formed on the one surface of the base substrate and bonding the silicon substrate to the film layer, processing the silicon substrate bonded to the film layer using the film layer as a stop layer and forming a lower hole portion, processing the base substrate using the film layer as the stop layer and removing the base substrate to expose the film layer, and forming an opening portion communicating with the lower hole portion in the exposed film layer.

Liquid ejection head, element substrate, and manufacturing methods thereof

A highly reliable liquid ejection head comprises a substrate made of silicon and having a first surface and a second surface opposite to the first surface, an ejection port forming member bonded to the first surface of the substrate and formed with an ejection port for ejecting liquid, and a bonded member configured to be bonded to the second surface of the substrate. A through flow path is formed in the substrate, which is configured to pass through the substrate and to supply liquid to the ejection port. A first protective film made of a metal oxide is formed on an inner surface of the through flow path, and a second protective film made of a silicon compound is formed on all of the second surface of the substrate.

Liquid ejection head and method for manufacturing the same

A liquid ejection apparatus includes a housing provided at least with an upper surface and side surfaces, and a liquid tank that is arranged in the housing and is refillable with a liquid from outside. A display unit that indicates a remaining liquid amount in the liquid tank is arranged at least at one of joining portions each joining the upper surface to one of the side surfaces.

Liquid ejection apparatus and liquid tank

A method of manufacturing a liquid discharge head includes preparing a first substrate where a discharge port configured to discharge liquid is formed to face a first surface, a concave portion is formed on a side of a second surface opposite to the first surface, and a first liquid flow passage penetrating from the first surface to the second surface is opened inside the concave portion on the side of the second surface, preparing a second substrate including a second liquid flow passage opened on a third surface, and sticking the first substrate and the second substrate to communicate the first liquid flow passage with the second liquid flow passage by bonding a bottom face of the concave portion and the third surface with an adhesive agent.

Method of manufacturing liquid discharge head and liquid discharge head in which a plurality of substrates including a liquid flow passage are satisfactorily stuck together with an adhesive agent

A liquid ejection head is provided with a recording element substrate, and the recording element substrate includes an ejection port member, an electric wiring layer including a pressure generating element array and electric connection portions, and a silicon substrate including the ejection port member and the electric wiring layer on a front surface. The silicon substrate includes a first through hole and a second through hole that protrude the electric connection portions. The rear surface of the silicon substrate is a (100) surface. An extension line of a side extending along the [110] direction, out of sides of the opening of the first trough hole and an extension line of a side extending along the [110] direction, out of sides of the opening of the second through hole are displaced from each other in a direction orthogonal to the [110] direction.

Liquid ejection head

A liquid ejection head including an element substrate including an ejection port, an energy generating element generating energy to eject a liquid from the ejection port, and a terminal electrically connected to the energy generating element, and an electric connection member connected to the terminal and that supplies electric power to the energy generating element. The element substrate includes a hole portion drilled from a surface of the element substrate opposite a surface of the element substrate in which the ejection port is provided to the terminal. A sealing member is provided inside the hole portion, the sealing member covering a connection portion. The liquid ejection head further includes a fixing member in contact with the surface of the element substrate in which the ejection port is formed, the fixing member being provided at a position corresponding to the hole portion.

Liquid ejection head and method of manufacturing same

Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.

Method of forming film on substrate and method of manufacturing liquid ejection head

A liquid ejection head includes an ejection port member that includes an ejection port that ejects a liquid, an energy generating element that generates energy for ejecting the liquid from the ejection port, a terminal electrically connected to the energy generating element, and a substrate portion that supports the ejection port member, the energy generating element, and the terminal. The terminal is connected to a wire member that supplies electric power that drives the energy generating element to the energy generating element, the substrate portion includes a hole portion formed from a surface of the substrate portion on a side opposite to a surface of the substrate portion on which the terminal is provided to a surface where the terminal is exposed, and an area of the surface where the terminal is exposed is smaller than an area of an opening of the hole portion.

Provided is a liquid ejection head substrate including: a substrate; a liquid ejection element that generates liquid ejection energy on the substrate; and an electrode pad that is electrically connected to the liquid ejection element, in which the electrode pad includes a barrier metal layer and a bonding layer on the barrier metal layer, and an end side surface of the barrier metal layer is covered with a silicon-based film containing carbon.

Liquid ejection head substrate and method for manufacturing the same

A semiconductor element includes an insulation layer and a pad portion for electrical connection to an external portion by wire bonding. The insulation layer includes a plurality of projections projecting from a main surface of the insulation layer. The pad portion is disposed on an upper surface of each of the projections without extending beyond the upper surface of the projection on which the pad portion is formed.

Semiconductor element, recording element substrate, and liquid discharge head

A liquid ejection head including a substrate, an energy generating element provided on the substrate, a film provided on the substrate and the energy generating element, and a flow path forming member provided on the substrate, forming a flow path of a liquid between the flow path forming member and the substrate, and having an ejection orifice at a position faced with the energy generating element, characterized in that the substrate has a supply path of the liquid communicating with the flow path, the flow path forming member has a structure protruding toward the supply path, and a peripheral shape of a distal end portion of the structure is a curved surface shape.

Liquid ejection head and manufacturing method thereof

A method for manufacturing a liquid ejection head substrate, in which a heat storage layer, a pair of electrodes extending from the surface of the heat storage layer toward the back surface, a heat-generating resistor layer in contact with the pair of electrodes and the surface of the heat storage layer, and a first cover layer configured to cover the heat-generating resistor layer are stacked, includes the steps of etching the heat-generating resistor layer and the first cover layer by using a mask disposed on a substrate including the heat-generating resistor layer and the first cover layer, removing the mask, and forming a second cover layer configured to cover an end portion of the heat-generating resistor layer in that order.

Method for manufacturing liquid ejection head substrate

Even if electrostatic discharge occurs, dielectric breakdown of an insulating layer for covering an element on a base substrate is inhibited. A substrate for an ink jet recording head includes: a base substrate including an element configured to apply energy for ejecting ink to ink and an insulating protective layer for covering the element; an ejection orifice forming member including an insulating first member for forming an ink flow path for supplying ink to the element and a second member including an ejection orifice surface having ejection orifices provided therein; and a columnar conductive member extending between the second member and the base substrate in a direction intersecting the ejection orifice surface.

Substrate for ink jet recording head

An element substrate including a base having a heat-generating resistor element which generates thermal energy used for discharging a liquid; an electrically conductive protective layer covering the heat-generating resistor element; an insulating layer provided between the heat-generating resistor element and the protective layer; and a potential applying unit for applying a potential to the protective layer such that a potential of the protective layer is lower than a potential at one end of the heat-generating resistor element and higher than a potential at the other end of the heat-generating resistor element with a voltage being applied between the one end and the other end of the heat-generating resistor element.

Element substrate and method for discharging liquid

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Yokohama, Japan

Souta Takeuchi