Delphi Technologies IP Limited

Soumyajit Routh

Kevin M Gertiser

Jack L Glenn

Kok Wee Yeo

John Mark Dikeman

Daniel C Penrod

Gregg Nelson Francisco

Thomas E Pritchett

Narendra J Mane

Gregg N Francisco

A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.

System and method for multi-point thermal path assessment

A method includes, responsive to an application of power to an IC, self-initializing the IC by asserting a reset signal for a reset period. Self-initializing the IC also includes, in response to an expiration of the reset period, deasserting the reset signal. Self-initializing the IC also includes, responsive to deasserting the reset signal, automatically obtaining first temperature data from at least one thermal sensing device associated with a die of the IC, and storing the first temperature data in a storage component of the IC.

Integrated circuit and method for capturing baseline die temperature data

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Kokomo, IN, United States of America

Soumyajit Routh