Fujitsu Corporation

Souichi Obata

Yasutomo Maehara

Takashi Kanda

Kiyotaka Seyama

Kazuhiko Iijima

Kaoru Sugimoto

It is an object of the present invention to enhance laser beam transmitting efficiency by accurately controlling an interval between a light emitting (light receiving) element () and an optical wave-guide substrate () without causing any fluctuation in the interval in a mounting structure of the light transmitting element in which the light emitting (light receiving) element () is mounted on the optical wave-guide substrate (). When the light emitting (light receiving) element is joined to the sub-mount chip () and when the sub-mount chip () is joined to the optical wave-guide while the element is being directed to the substrate side, the sub-mount chip and the optical wave-guide substrate are joined to each other by the solder bump (). A post () is arranged for regulating an interval between the light emitting (light receiving) element and the optical wave-guide substrate.

Printed board unit for optical transmission and mounting method

A multi-layer wiring board is produced by laminating a plurality of insulating layers having conductor circuits, wherein the conductor circuits of the insulating layers are electrically connected together through via-holes in insulating connection layers having no conductor circuit, and the regions other than the conductor circuits of the insulating layers and the regions other than the via-holes of the connection layers are directly joined together by press-adhering the insulating resins that constitute the respective layers.

Growing community of inventors

Kawasaki, Japan

Souichi Obata