Matsushita Electric Industrial Co., Ltd.

Nissho Corporation

Other

Souhei Tanaka

Kazuhiro Mori

Yoshihiko Misawa

Eiji Itemadani

Shigeru Araki

Yasuo Taki

Yukihiko Asao

Uzo Tomii

Akira Kabeshita

Tokuhito Hamane

Yozo Uotsu

Yoshinobu Maeda

Osamu Hikita

Taira Ishii

Teruo Shoji

Kanji Sugio

The band,which stores little parts,in many storing dents,arranged along a longitudinal direction and packs the little parts,by covering surfaces of the storing dents,with a cover tape,and is made of a flexible material having a compress-forming nature, and comprises storing dents,which are compress-formed from a surface to a fixed depth in a thickness direction.

Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts

Carrier band of electronic parts

The band 10 which stores little parts 20 in many storing dents 14 arranged along a longitudinal direction and packs the little parts 20 by covering surfaces of the storing dents 14 with a cover tape 30, and is made of a flexible material having a compress-forming nature, and comprises storing dents 14 which are compress-formed from a surface to a fixed depth in a thickness direction.

Packing band, packing method and packing apparatus, of little parts, and

In mounting electronic components (1) from an electronic components pack (5) to a substrate (10), the substrate (10) is put on a table movable horizontally in X-Y directions, and the electronic components (1) are held in through holding holes (3) in a holding plate (2). A selected one of the electronic components (1) is positioned just above a mounting position on the substrate (10) and a pushing pin (23 or 24 or 26) is positioned just above that electronic component (1). Then, the pushing pin (23 or 24 or 26) lowers and pushes the selected electronic component (1) down out of its holding hole (3) to mount it directly onto the substrate (10).

Method and apparatus for mounting electronic components

Electronic components are adhesively held by a flexible, expansible and contractible adhesive sheet, and pressing pins pressing one of the electronic component on a position to be mounted on a printed circuit substrate with penetrating the adhesive sheet. Then, electronic component is separated from the adhesive sheet by bringing up the adhesive sheet and at that time the electronic component is fixed on the printed circuit substrate by the pressing pins.

Method for mounting electronic components

Electronic parts outfitting device

Method of circuit connection across both surfaces of substrate

An electronic parts mounting apparatus using a band carrier for feeding electronic parts incrementally, the carrier being a strip having many recesses disposed at equal intervals each holding an electronic part and a tape covering the recesses. The apparatus has a support for horizontally supporting the carrier with the coating tape on the top side; a separator for separating the tape from the carrier; and a pickup device for picking up the electronic parts one by one from the recesses in the carrier and by carrying the electronic parts and placing them in position on a circuit board for continuously and stably mounting the electronic parts on the circuit board.

Electronic parts mounting apparatus

An electronic parts mounting apparatus using a band carrier for feeding electronic parts incrementally, the carrier being a strip having many recesses disposed at equal intervals each holding an electronic part and a tape covering the recesses. The apparatus has a support for horizontally supporting the carrier with the coating tape on the top side, a separator for separating the tape from the carrier; and a pick up device for picking up the electronic parts one-by-one from the recesses in the carrier and carrying the electronic parts and placing them in position on a circuit board for continuously and stably mounting the electronic parts on the circuit board.

An apparatus for carrying electronic components from a supply position to an electronic circuit board or the like and placing the electronic components on the electronic circuit board or the like, which has a rod provided at its tip end with a suction tool for picking up components to be carried and which is connected with an air suction apparatus; a body frame supporting the rod for movement of the rod in the vertical and horizontal directions; two pairs of position regulating pawls which are movably supported on the rod and are supported for freely opening and closing to grasp the components from different directions which the components are held by the suction tool and positioning them; and an arrangement for opening and closing the position regulating pawls.

Apparatus for carrying and placing components

A process for mounting electronic parts of very small size on electronic circuit boards or substrates, in which the substrates are maintained in predetermined relative positions, and a dispenser unit dispensing a bonding material for bonding the electronic parts to each of the substrates, a mounting unit mounting the electronic parts on each of the substrates, and/or an inspecting unit inspecting the position and/or the electrical properties of the electronic parts mounted on each of the substrates are disposed in the same relative positions as those of the substrates to carry out their individual functions on the associated substrates, so that the electronic parts can be efficiently and rationally mounted on the substrates.

Growing community of inventors

Neyagawa, Japan

Souhei Tanaka