Tatsuta Electric Wire & Cable Co., Ltd.

Sougo Ishioka

Hiroshi Tajima

Hiroaki Umeda

Masahiro Watanabe

Kenji Kamino

Yuusuke Haruna

Hajime Nakazono

Takahiko Katsuki

Hidetoshi Noguchi

Shirou Yamauchi

An electromagnetic wave shielding film with high bending resistance and high electromagnetic wave-shielding characteristics, even when used with high-frequency signal transmission, is disclosed. The electromagnetic wave shielding film includes an adhesive layer; a shielding layer placed on the adhesive layer; and an insulating layer placed on the shielding layer, wherein a plurality of openings having an opening area of 1 to 5000 μmare formed in the shielding layer, the openings include first openings having opening areas of more than 1 μmand 300 μmor less and second openings having opening areas of more than 300 μmand 5000 μmor less, and the percentage of the number (cumulative frequency) of the first openings among the openings is 30 to 90%, and the percentage of the number (cumulative frequency) of the second openings among the openings is 10 to 70%.

Electromagnetic wave shielding film

The present invention aims to provide a shield package having a highly distinctive patterned portion formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a sealing material, and a shield layer covering the package, wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and a ratio of Sal (autocorrelation length) of the non-patterned portion to Sal of the patterned portion is as follows: (Sal of non-patterned portion)/(Sal of patterned portion)>4.0.

Shield package

An affixation filmfor a printed wiring board includes a circuit pattern concealing layer, and an adhesive layerput on top of the circuit pattern concealing layer. An opposite surface of the circuit pattern concealing layerfrom the adhesive layerhas an Rku of 2.5-3.0.

Affixation film for printed wiring board

Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring boardaccording to the present invention includes a printed wiring board, an insulating layer, and a conductive adhesive layerdisposed between the printed wiring boardand the insulating layer. The printed wiring boardincludes a base, a circuit patterndisposed on the base, and an insulating protective layercovering the circuit pattern. The shielded printed wiring board has a through-holefor external grounding that vertically penetrates the insulating layerand the conductive adhesive layer. The conductive adhesive layerhas an extensionextending toward the inside of the through-holeas compared with the insulating layer

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Kizugawa, Japan

Sougo Ishioka