Intel Corporation

Soud Choudhury

Wei Ey Li

Edvin Cetegen

Christopher L Rumer

Xavier Francois Brun

Vipul V Mehta

Shan Zhong

Ziyin Lin

Hsin-Wei Wang

Yang Guo

Ifeanyi Okafor

Nai-Yuan Liu

An integrated circuit assembly may be formed comprising an electronic substrate, a first and second integrated circuit device each having a first surface, a second surface, at least one side extending between the first and second surface, and an edge defined at an intersection of the second surface and the at least one side of each respective integrated circuit device, wherein the first surface of each integrated circuit device is electrically attached to the electronic substrate, an underfill material between the first surface of each integrated circuit device and the electronic substrate, and between the sides of the first and second integrated circuit devices, and at least one barrier structure adjacent at least one of the edge of first integrated circuit device and the edge of the second integrated circuit device, wherein the underfill material abuts the at least one barrier structure.

Barrier structures for underfill containment

Growing community of inventors

Chandler, AZ, United States of America

Soud Choudhury