Sony Corporation

Sumitomo Heavy Industries, Ltd.

Sotaro Tsukamoto

Hiroyuki Murai

Mikio Komatsu

Kota Suzuki

Nobuhiro Hanai

Masato Hayashida

Satoru Kuromiya

There is provided a sensor including a sensor element, a substrate on which the sensor element is disposed, and a casing that accommodates the substrate. The casing has a doughnut shape, and has a connecting portion for externally connecting a wire. In a doughnut-shaped internal space of the casing, the substrate is disposed, and the wire is disposed in the connecting portion from a side of the substrate far from the connecting portion. A central cylinder portion is interposed between the substrate and the wire.

Sensor and sensor fixing structure

A wireless communication apparatus having a metal housing is provided, in which an outside antenna is not required and a small antenna the sensitivity of which does not decrease is included. A slitis provided on a metal housingof a wireless communication apparatus and a feederis connected to a position approximately three-quarters of the long side of the slitto be used as a &#x215c;&#x3bb; slit antenna.

Wireless communication apparatus

A wiring board houses a bare radio-frequency IC. Shield wiring films are provided above and below the IC. A plurality of shield interlayer-connection conductor films, i.e., shield via-holes, is provided so as to surround the IC. The shield wiring films and the shield interlayer-connection conductor films define a shield cage, which can electrostatically shield the IC. Thus, there is no need to attach a shield cap.

Wiring board and circuit module

Growing community of inventors

Aichi, Japan

Sotaro Tsukamoto