Mitsubishi Gas Chemical Company, Inc.

Sotaro Hiramatsu

Takashi Kobayashi

Kentaro Takano

Masanobu Sogame

Yoshinori Mabuchi

Kenji Arii

Ryoji Otaki

Shuta Kihara

Tomoo Tsujimoto

Jitsuo Oishi

Masayuki Katagiri

Makoto Tsubuku

Keita Tokuzumi

A resin composition comprising one or more cyanate compounds (A) selected from a group consisting of a naphthol aralkyl-based cyanate compound, a naphthylene ether-based cyanate compound, a xylene resin-based cyanate compound, a trisphenolmethane-based cyanate compound, and an adamantane skeleton-based cyanate compound; a polymaleimide compound (B) represented by general formula (1); and a filler (C).

Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board

A resin composition for a printed wiring board including: 

Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board

A resin composition for a printed wiring board containing a cyanate compound (A); a maleimide compound (B); and a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1): wherein R is a hydrogen atom or a substituent selected from a group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.

Resin composition, prepreg, metal-foil-clad laminate, resin composite sheet, and printed wiring board

The present invention is a cyanate ester compound represented by the following formula (1): 

Cyanate ester compound, curable resin composition containing the same, and hardened product thereof

A method for producing a colorless transparent resin film by a solution flow casting method containing: flow-casting an organic solvent solution of a polyamic acid or a polyimide on a support; and drying, the method containing at least the following step (1), step (2) and step (3) in this order, and an apparatus therefor:

Process and apparatus for production of colorless transparent resin film

In the process for producing an oxygen absorbing polyamide resin composition of the present invention, a diamine component containing 70 mol % or higher of m-xylylenediamine is polycondensed with a dicarboxylic acid component containing 50 mol % or higher of adipic acid in the presence of a phosphorus compound. A compound or complex containing at least one metal selected from the group consisting of transition metals of Group VIII of the Periodic Table, manganese, copper and zinc is added to reaction system either prior to initiation of the polycondensation reaction or during the polycondensation reaction such that a ratio (P/M) of a concentration of phosphorus P (mmol/g) in the phosphorus compound contained in the polyamide resin composition to a concentration of the metal M (mmol/g) in the polyamide resin composition is 0.02 to 1.0.

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Tokyo, Japan

Sotaro Hiramatsu