Qualcomm Incorporated

Sorin Adrian Dobre

Matthew Levi Severson

Lew G Chua-Eoan

Rajat Goel

Tsvetomir Petrov

Xiangdong Chen

Jon James Anderson

Nan Chen

Venugopal Boynapalli

Victor Adrian Chiriac

Hyeokjin Lim

Shih-Hsin Jason Hu

Mohamed Waleed Allam

Mohammad Reza Kakoee

Navid Toosizadeh

Min Chen

Geoffrey Shippee

Joseph Victor Zanotelli

Chih-tung Chen

Jasmin Smaila Ibrahimovic

Maria G Lupetini

Carlos Auyon

Tsvetomir P Petrov

In certain aspects, a semiconductor die includes a first cell and a second cell. The first cell includes first transistors, and a first interconnect structure interconnecting the first transistors to form a first circuit. The second cell includes second transistors, and a second interconnect structure interconnecting the second transistors to form a second circuit. The first circuit and the second circuit are configured to perform a same function, and a length of the first cell in a first lateral direction is greater than a length of the second cell in the first lateral direction.

Placement methodology to remove filler

An integrated circuit compensates for circuit aging by measuring the aging with an aging sensor and controlling a supply voltage based on the measured aging. The operating environment for the aging sensor can be set to reduce impacts of non-aging effects on the measured aging. For example, the operating environment can use a temperature inversion voltage. An initial aging measurement value which is the difference between an initial aged measurement and an initial unaged measurement can be stored on the integrated circuit. A core power reduction controller can use the measured aging and the stored initial aging measurement value to update a performance-sensor target value and then perform adaptive voltage scaling using the using the updated performance-sensor target value.

Integrated circuit adaptive voltage scaling with de-aging

Various embodiments of methods and systems for controlling and/or managing thermal energy generation on a portable computing device are disclosed. Data discarded from one or more processing core registers may be monitored and analyzed to deduce individual workloads that have been processed by each of the cores over a unit of time. From the deduced workloads, the power consumed by each of the cores over the unit of time in order to process the workload can be calculated. Subsequently, a time dependent power density map can be created which reflects a historical and near real time power consumption for each core. Advantageously, because power consumption can be correlated to thermal energy generation, the TDPD map can be leveraged to identify thermal aggressors for targeted, fine grained application of thermal mitigation techniques. In some embodiments, workloads may be reallocated from the identified thermal aggressors to the identified underutilized processing components.

On-chip thermal management techniques using inter-processor time dependent power density data for indentification of thermal aggressors

An integrated circuit includes multiple power domains. Supply current switch circuits (SCSCs) are distributed across each power domain. When a signal is present on a control node within a SCSC, the SCSC couples a local supply bus of the power domain to a global supply bus. An enable signal path extends through the SCSCs so that an enable signal can be propagated down a chain of SCSCs from control node to control node, thereby turning the SCSCs on one by one. When the domain is to be powered up, a control circuit asserts an enable signal that propagates down a first chain of SCSCs. After a programmable amount of time, the control circuit asserts a second enable signal that propagates down a second chain. By spreading the turning on of SCSCs over time, large currents that would otherwise be associated with coupling the local and global buses together are avoided.

Distributed supply current switch circuits for enabling individual power domains

In general, this disclosure is directed to circuitry for implementation of headswitches and footswitches in an ASIC for power management. The disclosed circuitry supports not only effective power management, but also efficient use of ASIC area, reduced complexity, and the use of electronic design automation (EDA) tools. In this manner, the disclosed circuitry can support enhanced performance and simplified ASIC design. In some cases, headswitch or footswitch circuitry may be implemented as a switch pad ring that extends around a hard macro forming part of an ASIC core. In other cases, headswitch or footswitch circuitry can be distributed within an ASIC core by embedding distributed headswitch or footswitch components under metal layer power routing coupled to standard cell rows.

Headswitch and footswitch circuitry for power management

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San Diego, CA, United States of America

Sorin Adrian Dobre