Mitsubishi Chemical Corporation

Sora Tomita

Junichi Nakamura

Takayuki Yoshida

Kenji Tsuruhara

Masashi Yokogi

Go Otani

Hiroki Shibata

Kazuyoshi Odaka

Eri Masuda

Kei Uchiyama

Rie Konishi

Kazuo Hirowatari

Yuichi Yayama

Yukie Nakashima

A bisphenol composition including 95% or more by mass of a bisphenol, wherein a bisphenol represented by the following general formula (II) in the bisphenol composition constitutes 150 mass ppm or more, and the bisphenol composition has a methanol dissolution color (Hazen color number) of 2 or less, In formula (II), X denotes a single bond, —CRR—, —O—, —CO—, —S—, —SO—, or —SO—, Rand Rindependently denote a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and Rand Rmay be bonded to each other to form a ring. A method for producing a polycarbonate resin using the bisphenol composition is also described.

Bisphenol composition and polycarbonate resin

There is provided an epoxy resin composition comprising a (meth)acrylic copolymer (A), an epoxy resin (B), and a curing agent (C), wherein the (meth)acrylic copolymer (A) has a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), and wherein a glass transition temperature (TgB) of a polymer obtained by polymerizing only the vinyl monomer (b) is 25° C. or less.

Macromonomer copolymer, epoxy resin composition, adhesive, molding material, and cured product

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Tokyo, Japan

Sora Tomita