Advanced Micro Devices Corporation

Sophocles R Metsis

Michael Ricchetti

A system and method for efficiently addressing dies in a three-dimensional stacked integrated circuit. Multiple stacked dies may be included in a single package or module. At least two of the dies are vertically stacked. One or more of the dies may include die enumeration logic that generates a unique die address space identifier (ID) for a particular die. Unless a die is a base die, each die receives a unique die ID for itself from a die placed below itself. The die then generates a unique die ID for one or more dies placed above itself and sends these die IDs to the dies located on top of itself. If a die is a base die, then the logic may receive a root value for a first unique die ID within the vertical stack from the package substrate or silicon based interposer beneath it.

Tree based adaptive die enumeration

A system includes multiple TAP controllers that can be independently powered up and down. When a first TAP controller is powered up from a powered-down state while a second TAP controller is already in a powered-up state, the first TAP controller is reset causing the first TAP controller to enter a reset state in response to the power-up of a module on which the first TAP controller is disposed. The first TAP controller enters an idle state and its control signal is gated to hold the first TAP controller in the idle state until the second TAP controller enters the idle state. Subsequently, the first TAP controller is released such that the control signal supplied to the first and second TAP controllers are equal, thereby synchronizing the first TAP controller and the second TAP controller.

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Wakefield, MA, United States of America

Sophocles R Metsis