Eaton Intelligent Power Limited

Semiconductor Manufacturing International (shanghai) Corporation

Sophia Zhang

Kevin Zhong

Darron Kirby Lacey

Tom Xiong

Lily Du

Saivaraprasad Murahari

Abdulkabir O Dansalami

Paul Kuang-Chi Lin

Huafei Huang

Electrical devices with lights having onboard secondary power supplies are configured with synchronizable zone-based operation and/or color selectable modes. The electrical devices can be power receptacles and can be connected to a line input of a power circuit of a power grid and can also have the onboard secondary (emergency power) power supplies. The devices are configured so that respective lights can automatically illuminate upon motion detection in a zone and/or upon a disruption to the power circuit or to a powered state of a particular electrical device. The devices can be configured to allow a user to select different color or color temperatures using a color selection circuit.

Electrical devices with lights and associated zone-synchronizable lighting systems with back-up power and related methods

An electric vehicle charging circuit breaker for charging an electric vehicle with power from a power source. The electric vehicle charging circuit breaker includes a circuit protection unit structured to provide circuit protection between the power source and the electric vehicle, an electric vehicle charging unit structured to control charging of the electric vehicle, a metering unit structured to meter power flowing between the power source and the electric vehicle, and a display unit structured to display information including at least one of metering information and a status of electric vehicle charging.

Electric vehicle charging circuit breaker

Method and system for defect detection in manufacturing integrated circuits. In an embodiment, the invention provides a method for identifying one or more sources for possible causing manufacturing detects in integrated circuits. The method includes a step for providing a plurality of semiconductor substrates. The method includes a step for processing the plurality of semiconductor substrates in a plurality of processing steps using a plurality of processing tools. The method additionally includes a step for providing a database, which includes data associated with the processing of the plurality of semiconductor substrates. The method further includes a step for testing the plurality of semiconductor wafers after the processing of the plurality of semiconductor substrates. Additionally, the method includes a step for detecting at least one defect characteristic associated with the plurality of the semiconductor substrates that have been processed. Moreover, the method includes a step for identifying a set of processing steps. For example, the set of processing step are possibly associated with the defect characteristic.

Method and system for defect detection in manufacturing integrated circuits

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Shanghai, China

Sophia Zhang