Samsung Electronics Co., Ltd.

Synopsys, Inc.

Sooryong Lee

Min-Cheol Kang

Hyeok Jong Lee

Levi D Barnes

Mincheol Kang

Robert M Lugg

Jaewon Yang

Sang Chul Yeo

Changhwan Kim

Kyenhee Lee

Kyen-hee Lee

Sangchul Yeo

Sunggon Jung

Xiaohai Li

Sung-Yong Moon

Eunju Kim

Disclosed is a semiconductor integrated circuit fabricating method of a semiconductor fabricating device which includes a processor executing a defect detection module includes receiving, at the defect detection module, a first capture image of the semiconductor integrated circuit and a first layout image, generating, at the defect detection module, a second layout image from the first capture image, generating, at the defect detection module, a contour image from the first capture image and the second layout image, detecting, at the defect detection module, a defect of the semiconductor integrated circuit based on the first layout image and the contour image, analyzing, at the semiconductor fabricating device, a correlation between a kind of the defect and process variations of the semiconductor integrated circuit, and changing, at the semiconductor fabricating device, at least one process variation having a correlation with the defect from among the process variations.

Electronic device including processor executing defect detection module, operating method of electronic device, and method for fabricating semiconductor integrated circuit

Disclosed are a method of forming an optical proximity correction (OPC) model and/or a method of fabricating a semiconductor device using the same. The method of forming the OPC model may include obtaining a scanning electron microscope (SEM) image, which is an average image of a plurality of images taken using one or more scanning electron microscopes, and a graphic data system (GDS) image, which is obtained by imaging a designed layout, aligning the SEM image and the GDS image, performing an image filtering process on the SEM image, extracting a contour from the SEM image, and verifying the contour. The verifying of the contour may be performed using a genetic algorithm. Variables in the genetic algorithm may include first parameters related to the image alignment process, second parameters related to the image filtering process, and third parameters related to a critical dimension (CD) measurement process.

Method of forming optical proximity correction model and method of fabricating semiconductor device using the same

An operating method of a computing device for predicting a profile using deep learning includes sampling a unique pattern in a full chip, extracting a contour of a resist profile of each of a plurality of heights by performing rigorous simulation corresponding to the unique pattern, preparing an input image and an output image corresponding to the contour of each of the plurality of heights, performing deep learning on the extracted contour using the input image and the output image, and generating a profile prediction model according to performing of the deep leaning.

Computing device for predicting a profile using deep learning and operating method thereof

The inventive concept provides a defect detection method of a semiconductor element, capable of promptly and accurately detecting a defect, and predicting a type of the defect with respect to various defects of the semiconductor element, and a semiconductor element manufacturing method including the defect detection method. The defect detection method is capable of promptly and accurately detecting the defect, and predicting the type of the defect with respect to various defects of the semiconductor element, by generating a first segmentation image and a second segmentation image; converting the first segmentation image and the second segmentation image into an image of a first color and a second color, respectively; generating a combination image; classifying the type of a defect; generating a defect detection model by using deep learning, and detecting a defect of the semiconductor element by using a defect detection process using the defect detection model.

Defect detection method of deep learning-based semiconductor device and semiconductor element manufacturing method including the defect detection method

A method for correcting a mask layout includes providing a mask layout including first patterns, each of the first patterns having a size related to a first critical dimension (CD) value, obtaining topography data on a region of a wafer, generating a defocus map using the topography data, and correcting the mask layout on the basis of the defocus map. The generating of the defocus map includes respectively setting second CD values for a plurality of sub-regions of the mask layout. The second CD values may be set based on the topography data. The correcting of the mask layout on the basis of the defocus map comprises correcting the sizes of the first patterns to be related to the second CD values.

Method for correcting a mask layout and method of fabricating a semiconductor device using the same

One embodiment of the present invention provides a system that adjusts assist features in a layout to prevent assist features from printing. During operation, the system receives a layout. The system then identifies an assist-feature (AF)-printing hotspot in the layout, wherein the AF-printing hotspot includes a set of assist features and one or more target patterns in proximity to the set of assist features. At least one assist feature in the set of assist features is expected to print during a lithography process. Next, the system modifies the AF-printing hotspot by: (1) modifying the set of assist features; and (2) performing optical-proximity-correction (OPC) on the one or more target patterns. The system then performs a lithography simulation on the modified AF-printing hotspot to determine if: (1) a through-process-window associated with the modified AF-printing hotspot is acceptable; and (2) no assist feature in the modified set of assist features is expected to print. If so, the system replaces the AF-printing hotspot with the modified AF-printing hotspot.

Method and apparatus for correcting assist-feature-printing errors in a layout

Growing community of inventors

Seoul, South Korea

Sooryong Lee