Samsung Electronics Co., Ltd.

SoonYong Hur

Taek-Sung Kim

Sangbo Lee

A semiconductor package includes first and second slave chips stacked vertically; and a master chip connected to the first and second slave chips, each of the slave chips including, a plurality of memory blocks, and a redundancy block, and the master chip including, a fuse block configured to repair a defective memory block detected from the first slave chip and a defective memory block detected from the second slave chip by using the redundancy block of the first slave chip and the redundancy block of the second slave chip, respectively, and a block selection circuit configured to, connect the redundancy blocks of the first and second slave chips, one or more non-defective ones of the plurality of memory blocks of the first slave chip, and one or more non-defective ones of the plurality of memory blocks of the second slave chip to an input/output circuit.

Growing community of inventors

Hwaseong-si, South Korea

SoonYong Hur