Samsung Electronics Co., Ltd.

Soonbum Kim

Junho Lee

Hongbin Shi

A method for manufacturing a semiconductor package including providing a first semiconductor package including a first package substrate and a first solder ball, the first package substrate having a first surface and a second surface opposite to the first surface, the first solder ball on the first surface, providing a second semiconductor package including a second package substrate and a second solder ball, the second package substrate having a third surface and a fourth surface opposite to the third surface, the second solder ball on the third surface, forming a depression in the first solder ball, applying flux to the first solder ball to fill the depression, aligning the first semiconductor package and the second semiconductor package with each other such that the second solder ball is inserted into the depression, and performing a reflow process to combine the first solder ball with the second solder ball may be provided.

Method for manufacturing semiconductor package

A semiconductor package, a semiconductor module, a method of fabricating a semiconductor package are disclosed. The semiconductor package may include a substrate, a semiconductor chip, a connection terminal, a mold layer, and a protection layer. The protection layer may be provided to cover the substrate, the connection terminal, and the mold layer. The protection layer may be removed from a lower portion of the connection terminal, and thus, the lower portion of the connection terminal may be exposed. The connection terminal may be coupled to a module substrate through the lower portion, and a result, the semiconductor module may be fabricated. The connection terminal, the substrate, and the mold layer may be prevented from being exposed to outer air or moisture, owing to the presence of the protection layer.

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Suwon-si, South Korea

Soonbum Kim