Advanced Micro Devices Corporation

Soon Tatt Ow Yong

Seah Sun Too

Hsiang Wan Liau

Kevin W Lim

Kee Hean Keok

Azlina N Nayan

Yeow Guan Teh

Various methods and apparatus for holding a semiconductor chip package are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first plate adapted to hold a semiconductor chip package. The semiconductor chip package includes a carrier substrate and at least one semiconductor chip coupled to the carrier substrate. A second plate is formed with a first opening defining an interior peripheral surface adapted to compress an outer edge of the carrier substrate between the first plate and the second plate without engaging the at least one semiconductor chip.

Semiconductor chip package fixture

Double-sided waffle packs and methods of using the same are provided. In one aspect, a waffle pack is provided that includes a body that has a first side and second side opposite the first side. The first side has a first cavity for enabling a semiconductor die to be seated therein when the body is in a first orientation. The second side has a second cavity for enabling a semiconductor die to be seated therein when the body is in a second orientation opposite the first orientation. The first cavity has a first footprint and the second cavity has a second footprint. The first and second footprints are substantially aligned vertically.

Double-sided waffle pack

Growing community of inventors

Penang, Mali

Soon Tatt Ow Yong