Saehan Industries Incorporation

Cheil Synthetics Incorporation

Saehan Industries Incorporated

Saehan Micronics Incorporation

Soon Sik Kim

Kyeong Ho Chang

Kyung Rok Lee

Jeong Min Kweon

Dae W Ihm

Bo Sung Kim

Seon Hwi Cho

Sang Woon Lee

Dae Woo Im

Tae Whan No

Deog Jae Jo

Young Hoon Kim

Sung Ro Yoon

Hoon Hyung

Hwa Il Jin

Jin Woo Lee

Iee K Kim

Hee S Ihm

A method of manufacturing a plastic container includes adding nano-sized silica particles to a saturated polyester in an amount of 20 ppm to 10% by weight during transesterification or esterification and polycondensing an aromatic dicarboxylic acid and ethylene glycol as starting materials. The silica particles have an average particle diameter of 3&#x2013;100 nm. The saturated polyester is polyethyleneterephthalate.

Saturated polyester for plastic containers with excellent heat resistance and gas impermeability and method for manufacturing the same

A domestic nanofiltration membrane based water purifier without a storage tank. The water purifier according to the present invention uses a nanofiltration membrane filter as a main filtering section and does not have a storage tank for containment of purified water. Although conventional reverse osmosis membrane based water purification systems provide good quality water, they have problems in that installation of the storage tanks due to insufficient flow rate results in the increased volumes of water purifiers, and at the same time, secondary pollution may be caused by microorganism propagation upon prolonged storage. In this regard, the present invention provides a domestic nanofiltration membrane based water purifier without a storage tank, in which a nanofiltration membrane filter with a pore size of approximately 0.1 to 10 nm is used as a main filtering section.

Domestic nanofiltration membrane based water purifier without storage tank

An insulating tape for use in LOC (lead-on-chip) type semiconductor chip packages. With a tripartite structure in which two adhesive layers are provided to both surfaces of a base film, the insulating tape ranges, in coefficient of thermal expansion, from 16.0 to 23.5 ppm/&deg; C. and is very useful in improving the reliability of LOC semiconductor chip packages having lead frames.

Insulating adhesive tape for a semiconductor chip package having a copper lead frame

A method for preparing polyamic acid and polyimide of three-dimensional molecular structure such that these polymers are superior in adhesive strength and high-temperature stability while maintaining their inherent thermal resistance and mechanical properties, and thus can be effectively used as an adhesive material for high temperature adhesive tapes suitable for semiconductor assembly. The polyamic acid is prepared by reacting at least one tetracarboxylic dianhydride, at least one aromatic diamine, at least one diamine with a siloxane structure, represented by the following general formula I, and at least one polyamino compound represented by the following general formula II or III:

Method for the preparation of polyamic acid and polyimide

An adhesive tape which can bond electronic parts at the environs of a lead frame, such as leads, diepads and radiant plate semiconductor chips, to each other and is superior in adhesiveness, thermal resistance and electrical properties. The adhesive tape is produced by coating on one side or both sides of a thermal resistant film an adhesive composition including an acryl resin, a mixed epoxy resin of a bisphenol A-type epoxy resin and a cresol novolak epoxy or a phenol novolak epoxy resin, a maleimide compound containing at least two intramolecular maleimide groups, an aromatic diamine compound, an epoxy-containing liquid silicon resin and an organic or inorganic filler and drying it.

Adhesive tape for electronic parts

A polymide useful as an adhesive for semiconductor assemblies having excellent thermal resistance and adhesive strength at high temperatures. The polyimide adhesive is based on the polyimide represented by the following formula II which can be prepared through the thermal or chemical imidization of the polyamic acid represented by the following formula I:

Polyimide for high temperature adhesive

A method for preparing polyamic acid and polyimide, which is suitable for use in adhesives or adhesive tapes for electronic parts. The polymers have such three-dimensional molecular structures that a significant improvement can be brought about in solvent solubility, thermal resistance, mechanical properties, and adhesive properties onto various substrates. The polyamic acid is prepared by reacting at least one tetracarboxylic dianhydride, at least one aromatic diamine, at least one diamine with a siloxane structure, represented by the following general formula I, and at least one polyamino compound represented by the following general formula II or III. The polyamic acid is converted into polyimide through thermal or chemical imidization.

Method for the preparation of polyamic acid and polymide useful for adhesives

A pigment-dispersed photoresist composition for a color filter of liquid crystal display, which comprises a photosensitive resin composition comprising a binder resin, a multifunctional acrylate monomer or oligomer, a polyene compound containing at least unsaturated group the main chain of which may be substituted with esters or urethanes, a multifunctional thiol compound, a photopolymerization initiator, a sensitizer, a soft polymerization inhibitor and an organic solvent, and a pigment-dispersed composition comprising pigment, a polymeric dispersing agent and/or a pigment-derived dispersing agent in combination with a surfactant a leveling agent, a slip agent, an antifoaming agent and an organic solvent, is disclosed. Superior in physical properties including thermal resistance, light fastness, spectroscopicity, color reproduction (chromaticity), dispersing stability, adhesiveness to substrate, resolution and photosensitivity, the pigment-dispersed photoresist composition can afford a fine pattern with high definition.

Pigment-dispersed photoresist composition for color filter of liquid

A photopolymerization photoresist composition having a binder resin, a multifunctional compound, a photopolymerization initiator, a sensitizer and other additives. The photopolymerization initiator has one or more 4,6-bis(chloromethyl)-s-triazine compound containing a diazophenyl group. The initiator acts as a chromophore and is represented by the following general formula I: ##STR1## wherein the position at which the diazo group bonds to phenyl group may be changed. R is an aliphatic radical or an unsubstituted- or substituted aromatic radical and n is an integer of 0 to 2.

Photoresist composition containing 4,6-(bis)chloromethyl-5-triazine

A method for the preparation of prepreg of thermoplastic composite resin is disclosed. The method comprises the steps of: laminating a non-oriented glass fibrous mat experiencing needle punching on a base layer of a polypropylene film; forming a complex layer which comprises a plurality of yarns unidirectionally oriented on the both sides of a polypropylene film on the non-oriented glass fibrous mat atop the base layer; overlying a needled, non-oriented glass fibrous mat on the complex layer of the unidirectionally oriented glass fibrous yarn/polypropylene film/unidirectionally oriented glass fibrous yarn; covering a top layer of a polypropylene film over the needled, non-oriented glass fibrous mat, to form a laminate; and pressing the laminate at high temperatures under high pressures. By virtue of employing the unidirectionally oriented glass fibrous yarns which can be satisfactorily impregnated into the polypropylene resin, the prepreg of thermoplastic composite resin is superior in mechanical strength, thermal resistance and fluidity. Thermoplastic composite material containing unidirectionally oriented glass fibers with no damage can be used as substance requiring high strength, such as construction materials, machine elements and etc and as articles requiring compress molding, such as auto parts, especially bumper beam.

Growing community of inventors

Seoul, South Korea

Soon Sik Kim